Realtime 3D stress measurement in curing epoxy packaging

Jacob Richter; A. Hyldgård; Karen Birkelund; Ole Hansen; Erik Vilain Thomsen

doi:10.1109/SENSOR.2007.4300575

Realtime 3D stress measurement in curing epoxy packaging

Jacob Richter
, A. Hyldgård
, Karen Birkelund
, Ole Hansen
, Erik Vilain Thomsen

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

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Abstract

This paper presents a novel method to characterize stress in microsystem packaging. A circular p-type piezoresistor is implemented on a (001) silicon chip. We use the circular stress sensor to determine the packaging induced stress in a polystyrene tube filled with epoxy. The epoxy curing process is monitored by stress measurements. From the stress measurements we conclude that the epoxy cures in 8 hours at room temperature. We find the difference in in-plane normal stresses to be sigmaxx-sigmayy=6.7 MPa and (sigmaxx+sigmayy-0.4sigmazz)=232 MPa.

Original language	English
Title of host publication	International Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007.
Publisher	IEEE
Publication date	2007
Pages	2083-2084
ISBN (Print)	1-4244-0841-5
DOIs	https://doi.org/10.1109/SENSOR.2007.4300575
Publication status	Published - 2007
Event	14th International Solid-State Sensors, Actuators and Microsystems Conference - Lyon, France Duration: 10 Jun 2007 → 14 Jun 2007 http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=4300055

Conference

Conference	14th International Solid-State Sensors, Actuators and Microsystems Conference
Country/Territory	France
City	Lyon
Period	10/06/2007 → 14/06/2007
Internet address	http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=4300055

Bibliographical note

Copyright: 2007 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE

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10.1109/SENSOR.2007.4300575

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@inproceedings{68c1d937492f4b4d97acf37082d9ee8f,

title = "Realtime 3D stress measurement in curing epoxy packaging",

abstract = "This paper presents a novel method to characterize stress in microsystem packaging. A circular p-type piezoresistor is implemented on a (001) silicon chip. We use the circular stress sensor to determine the packaging induced stress in a polystyrene tube filled with epoxy. The epoxy curing process is monitored by stress measurements. From the stress measurements we conclude that the epoxy cures in 8 hours at room temperature. We find the difference in in-plane normal stresses to be sigmaxx-sigmayy=6.7 MPa and (sigmaxx+sigmayy-0.4sigmazz)=232 MPa.",

author = "Jacob Richter and A. Hyldg{\aa}rd and Karen Birkelund and Ole Hansen and Thomsen, \{Erik Vilain\}",

note = "Copyright: 2007 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE; 14th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS 2007 ; Conference date: 10-06-2007 Through 14-06-2007",

year = "2007",

doi = "10.1109/SENSOR.2007.4300575",

language = "English",

isbn = "1-4244-0841-5",

pages = "2083--2084",

booktitle = "International Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007.",

publisher = "IEEE",

address = "United States",

url = "http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=4300055",

}

Richter, J, Hyldgård, A, Birkelund, K , Hansen, O & Thomsen, EV 2007, Realtime 3D stress measurement in curing epoxy packaging. in International Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007.. IEEE, pp. 2083-2084, 14th International Solid-State Sensors, Actuators and Microsystems Conference, Lyon, France, 10/06/2007. https://doi.org/10.1109/SENSOR.2007.4300575

TY - GEN

T1 - Realtime 3D stress measurement in curing epoxy packaging

AU - Richter, Jacob

AU - Hyldgård, A.

AU - Birkelund, Karen

AU - Hansen, Ole

AU - Thomsen, Erik Vilain

N1 - Copyright: 2007 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE

PY - 2007

Y1 - 2007

N2 - This paper presents a novel method to characterize stress in microsystem packaging. A circular p-type piezoresistor is implemented on a (001) silicon chip. We use the circular stress sensor to determine the packaging induced stress in a polystyrene tube filled with epoxy. The epoxy curing process is monitored by stress measurements. From the stress measurements we conclude that the epoxy cures in 8 hours at room temperature. We find the difference in in-plane normal stresses to be sigmaxx-sigmayy=6.7 MPa and (sigmaxx+sigmayy-0.4sigmazz)=232 MPa.

AB - This paper presents a novel method to characterize stress in microsystem packaging. A circular p-type piezoresistor is implemented on a (001) silicon chip. We use the circular stress sensor to determine the packaging induced stress in a polystyrene tube filled with epoxy. The epoxy curing process is monitored by stress measurements. From the stress measurements we conclude that the epoxy cures in 8 hours at room temperature. We find the difference in in-plane normal stresses to be sigmaxx-sigmayy=6.7 MPa and (sigmaxx+sigmayy-0.4sigmazz)=232 MPa.

U2 - 10.1109/SENSOR.2007.4300575

DO - 10.1109/SENSOR.2007.4300575

M3 - Article in proceedings

SN - 1-4244-0841-5

SP - 2083

EP - 2084

BT - International Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007.

PB - IEEE

T2 - 14th International Solid-State Sensors, Actuators and Microsystems Conference

Y2 - 10 June 2007 through 14 June 2007

ER -

Realtime 3D stress measurement in curing epoxy packaging

Abstract

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