Realtime 3D stress measurement in curing epoxy packaging

Jacob Richter, A. Hyldgård, Karen Birkelund, Ole Hansen, Erik Vilain Thomsen

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    Abstract

    This paper presents a novel method to characterize stress in microsystem packaging. A circular p-type piezoresistor is implemented on a (001) silicon chip. We use the circular stress sensor to determine the packaging induced stress in a polystyrene tube filled with epoxy. The epoxy curing process is monitored by stress measurements. From the stress measurements we conclude that the epoxy cures in 8 hours at room temperature. We find the difference in in-plane normal stresses to be sigmaxx-sigmayy=6.7 MPa and (sigmaxx+sigmayy-0.4sigmazz)=232 MPa.
    Original languageEnglish
    Title of host publicationInternational Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007.
    PublisherIEEE
    Publication date2007
    Pages2083-2084
    ISBN (Print)1-4244-0841-5
    DOIs
    Publication statusPublished - 2007
    Event14th International Solid-State Sensors, Actuators and Microsystems Conference - Lyon, France
    Duration: 10 Jun 200714 Jun 2007
    http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=4300055

    Conference

    Conference14th International Solid-State Sensors, Actuators and Microsystems Conference
    CountryFrance
    CityLyon
    Period10/06/200714/06/2007
    Internet address

    Bibliographical note

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