Abstract
This paper presents the development of the process chain for the generation of high precision shaped micro grooves on ceramic substrate for applications in the high precision micro bonding process. The groove’s cross section consists of a 90° V shape with a depth of 200 µm and a 40 µm wide rectangular feature underneath. For manufacturing of the grooves a grooving process was chosen and a tool was manufactured by micro electro discharge milling. The accuracy of the tool was evaluated by means of a SEM. Grooves were measured using a stylus profilometer. The results showed that the required accuracy of 3 µm on the groove’s depth was matched by the developed process chain.
| Original language | English |
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| Title of host publication | Proceedings of the EUSPEN |
| Volume | Vol. 2 |
| Place of Publication | Baden bei Wien, Vienna, Austria |
| Publisher | euspen |
| Publication date | 2006 |
| Pages | 192-195 |
| Publication status | Published - 2006 |
| Event | 6th International Conference European Society for Precision Engineering and Nanotechnology - Baden bei Wien, Vienna, Austria Duration: 28 May 2006 → 1 Jun 2006 Conference number: 6 |
Conference
| Conference | 6th International Conference European Society for Precision Engineering and Nanotechnology |
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| Number | 6 |
| Location | Baden bei Wien |
| Country/Territory | Austria |
| City | Vienna |
| Period | 28/05/2006 → 01/06/2006 |