Realization and characterization of high precision micro grooves on green ceramic

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    Abstract

    This paper presents the development of the process chain for the generation of high precision shaped micro grooves on ceramic substrate for applications in the high precision micro bonding process. The groove’s cross section consists of a 90° V shape with a depth of 200 µm and a 40 µm wide rectangular feature underneath. For manufacturing of the grooves a grooving process was chosen and a tool was manufactured by micro electro discharge milling. The accuracy of the tool was evaluated by means of a SEM. Grooves were measured using a stylus profilometer. The results showed that the required accuracy of 3 µm on the groove’s depth was matched by the developed process chain.
    Original languageEnglish
    Title of host publicationProceedings of the EUSPEN
    VolumeVol. 2
    Place of PublicationBaden bei Wien, Vienna, Austria
    Publishereuspen
    Publication date2006
    Pages192-195
    Publication statusPublished - 2006
    Event6th International Conference European Society for Precision Engineering and Nanotechnology - Baden bei Wien, Vienna, Austria
    Duration: 28 May 20061 Jun 2006
    Conference number: 6

    Conference

    Conference6th International Conference European Society for Precision Engineering and Nanotechnology
    Number6
    LocationBaden bei Wien
    CountryAustria
    CityVienna
    Period28/05/200601/06/2006

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