Reactive ion etching of polymer materials for an energy harvesting device

Fei Wang, Christian Vinther Bertelsen, Gustav Skands, Thomas Pedersen, Ole Hansen

Research output: Contribution to journalJournal articleResearchpeer-review


In this paper, we have demonstrated deep reactive ion etching (RIE) of two MEMS compatible polymer materials CYTOP and TOPAS, which may be useful for energy harvesting devices. The CYTOP polymer was patterned and used as the electret for the following corona charging while the TOPAS polymer was used as the wafer bonding material. Three mask materials (Al, photoresist and Si) were investigated for the RIE process. Grass effect was observed for both polymers when Al was used as the etching mask. With an optimized RIE recipe, a 1.5μm-thick photoresist layer served well as an etching mask for 11μm-thick CYTOP and a high selectivity of 9 was achieved. The CYTOP polymer was corona charged with target surface potential after patterning. Wafer-level bonding between CYTOP and TOPAS polymers was successfully performed with a low temperature thermo-compression bonding technique.
Original languageEnglish
JournalMicroelectronic Engineering
Pages (from-to)227-230
Publication statusPublished - 2012
Event37th International Conference on Micro and Nano Engineering - Berlin, Germany
Duration: 19 Sep 201123 Sep 2011
Conference number: 37


Conference37th International Conference on Micro and Nano Engineering
Internet address


  • Energy harvesting
  • Reactive ion etching
  • Polymer electret
  • Wafer bonding

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