Quantitative texture analysis of electrodeposited line patterns

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    Free-standing line patterns of Cu and Ni were manufactured by electrochemical deposition into lithographically prepared patterns. Electrodeposition was carried out on top of a highly oriented Au-layer physically vapor deposited on glass. Quantitative texture analysis carried out by means of x-ray diffraction for both the substrate layer and the electrodeposits yielded experimental evidence for epitaxy between Cu and Au. An orientation relation between film and substrate was discussed with respect to various concepts of epitaxy. While the conventional mode of epitaxy fails for the Cu-Au-system, it is shown that the experimentally observed orientation relation can be conceived as a 30 degree rotation of Cu (111) grown on Au (111) (rotational epitaxy)
    Original languageEnglish
    JournalMaterials Science Forum
    Pages (from-to)1455-1460
    Publication statusPublished - 2005

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