Quantitative TEM analysis of Al/Cu multilayer systems prepared by pulsed laser deposition

Haihua Liu, Nini Pryds, Jørgen Schou, Xiaoxu Huang

    Research output: Contribution to journalJournal articleResearchpeer-review

    Abstract

    Thin films composed of alternating Al/Cu/Al layers were deposited on a (111) Si substrate using pulsed laser deposition (PLD). The thicknesses of the film and the individual layers, and the detailed internal structure within the layers were characterized by means of transmission electron microscopy (TEM), high-resolution TEM (HRTEM), and energy-filtered TEM (EFTEM). Each Al or Cu layer consists of a single layer of nano-sized grains of different orientations. EFTEM results revealed a layer of oxide about 2 nm thick on the surface of the Si substrate, which is considered to be the reason for the formation of the first layer of nano-sized Al grains. The results demonstrate that the PLD technique is a powerful tool to produce nano-scale multilayered metal films with controllable thickness and grain sizes.
    Original languageEnglish
    JournalApplied Physics A: Materials Science & Processing
    Volume101
    Issue number4
    Pages (from-to)677-680
    ISSN0947-8396
    DOIs
    Publication statusPublished - 2010

    Keywords

    • Materials characterization and modelling
    • Materials and energy storage

    Fingerprint

    Dive into the research topics of 'Quantitative TEM analysis of Al/Cu multilayer systems prepared by pulsed laser deposition'. Together they form a unique fingerprint.

    Cite this