Quantitative microstructure characterization of self-annealed copper films with electron backscatter diffraction

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Electron backscatter diffraction (EBSD) was applied to analyze cross sections of self-annealed copper electrodeposits, for which earlier the kinetics of self-annealing had been investigated by in-situ X-ray diffraction (XRD). The EBSD investigations on the grain size, grain boundary character and crystallographic texture of copper films with different thicknesses essentially supplement results from in-situ XRD. Twin relations between neighboring grains were identified from the orientation maps and the observed twin chains confirm multiple twinning in copper electrodeposits as the mechanism of microstructure evolution at room temperature (self-annealing).
Original languageEnglish
JournalPhysica Status Solidi - A - Applications and Materials Science
Issue number2
Pages (from-to)275-281
Publication statusPublished - 2008

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