Quantitative calibration of conductive pattern growth via electroless copper plating at nano-resolution

Material Science

• Atomic Force Microscopy 13%
• Conductivity 6%
• Copper 100%
• Electroless Deposition 40%
• Electronics 6%
• Film 6%
• Impurity 13%
• Material 6%
• Metallization 6%
• Oxide 6%
• Plastics 6%
• Plating 100%
• Polyimide 6%
• Reducing Agent 6%
• Secondary Ion Mass Spectrometry 13%
• Silver 13%
• Strand 6%
• Surface 33%
• Surface Morphology 6%

Chemistry

• Atomic Force Microscopy 13%
• Conductivity 6%
• Contaminant 13%
• Copper Oxide 6%
• Depth Profiling 6%
• Flexibility 6%
• Formaldehyde 6%
• Instrumentation 6%
• Liquid Film 6%
• Phase Composition 6%
• Plastic 6%
• Polyimide Macromolecule 6%
• Potential 6%
• Procedure 20%
• Purity 6%
• Quantization 6%
• Reducing Agent 6%
• Surface 20%
• Surface Chemistry 20%
• Time-of-Flight Secondary Ion Mass Spectrometry 13%