Pulse plating has previously been reported to improve the properties of nickel and nickel alloy deposits. Typically, focus has been on properties such as grain size, hardness and smoothness. When pulse plating is to be utilized for micro electromechanical systems (MEMS), internal stress and material distribution is even more important. Using a bath consisting mostly of nickel chloride, pulse reversal plating of both pure nickel and nickel-cobalt alloys has been used to fabricate tools for micro-injection molding. Pulse reversal plating of ternary soft-magnetic alloys, comprising 45-65 percent Co, 15-35 percent Fe and 15-35 percent Ni, will also be reported.
|Title of host publication||SUR/FIN 2001|
|Publication status||Published - 2001|
|Event||SUR/FIN Manufacturing and Technology Conference 2001 - Nashville,TN, United States|
Duration: 5 Nov 2001 → …
|Conference||SUR/FIN Manufacturing and Technology Conference 2001|
|Period||05/11/2001 → …|
|Sponsor||The National Association for Surface Finishing|