Pulse Reversal Plating of Nickel and Nickel Alloys for MEMS

Peter Torben Tang

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

    Abstract

    Pulse plating has previously been reported to improve the properties of nickel and nickel alloy deposits. Typically, focus has been on properties such as grain size, hardness and smoothness. When pulse plating is to be utilized for micro electromechanical systems (MEMS), internal stress and material distribution is even more important. Using a bath consisting mostly of nickel chloride, pulse reversal plating of both pure nickel and nickel-cobalt alloys has been used to fabricate tools for micro-injection molding. Pulse reversal plating of ternary soft-magnetic alloys, comprising 45-65 percent Co, 15-35 percent Fe and 15-35 percent Ni, will also be reported.
    Original languageEnglish
    Title of host publicationSUR/FIN 2001
    PublisherAESF
    Publication date2001
    Publication statusPublished - 2001
    EventSUR/FIN Manufacturing and Technology Conference 2001 - Nashville,TN, United States
    Duration: 5 Nov 2001 → …

    Conference

    ConferenceSUR/FIN Manufacturing and Technology Conference 2001
    Country/TerritoryUnited States
    CityNashville,TN
    Period05/11/2001 → …
    SponsorThe National Association for Surface Finishing

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