Pulse Reversal PermAlloy Plating Process for MEMS Applications

Kristian Smistrup, Peter Torben Tang, Per Møller

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    Nickel-iron, and especially Permalloy, plating has been knownand used for more than 40 years, but there are still severalproblems related to stability and maintenance that should beresolved. This paper presents a saccharine-free pulse reversalplating Permalloy electrolyte, which gives low-stress deposits.We demonstrate selected MEMS applications of the electrolyte.The use of the strong complexing agent 5-sulfosalicylic acidallows for a photometric determination of the Fe3+-level in thebath and eliminate precipitates. This makes the electrolytesuitable as a Permalloy plating process used on an irregular basis.
    Original languageEnglish
    JournalE C S Transactions
    Issue number25
    Pages (from-to)179-189
    Publication statusPublished - 2007
    EventECS Meeting : Magnetic Materials Processes, and Devices 9 - Cancun, Mexico
    Duration: 1 Jan 2006 → …
    Conference number: 210th


    ConferenceECS Meeting : Magnetic Materials Processes, and Devices 9
    CityCancun, Mexico
    Period01/01/2006 → …

    Bibliographical note

    Copyright The Electrochemical Society, Inc. [2007]. All rights reserved. Except as provided under U.S. copyright law, this work may not be reproduced, resold, distributed, or modified without the express permission of The Electrochemical Society (ECS).

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