Pulse Reversal PermAlloy Plating Process for MEMS Applications

Kristian Smistrup; Peter Torben Tang; Per Møller

doi:10.1149/1.2753252

Pulse Reversal PermAlloy Plating Process for MEMS Applications

Kristian Smistrup, Peter Torben Tang, Per Møller

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Abstract

Nickel-iron, and especially Permalloy, plating has been knownand used for more than 40 years, but there are still severalproblems related to stability and maintenance that should beresolved. This paper presents a saccharine-free pulse reversalplating Permalloy electrolyte, which gives low-stress deposits.We demonstrate selected MEMS applications of the electrolyte.The use of the strong complexing agent 5-sulfosalicylic acidallows for a photometric determination of the Fe3+-level in thebath and eliminate precipitates. This makes the electrolytesuitable as a Permalloy plating process used on an irregular basis.

Original language	English
Journal	E C S Transactions
Volume	3
Issue number	25
Pages (from-to)	179-189
ISSN	1938-5862
DOIs	https://doi.org/10.1149/1.2753252
Publication status	Published - 2007
Event	ECS Meeting : Magnetic Materials Processes, and Devices 9 - Cancun, Mexico Duration: 1 Jan 2006 → … Conference number: 210th

Conference

Conference	ECS Meeting : Magnetic Materials Processes, and Devices 9
Number	210th
City	Cancun, Mexico
Period	01/01/2006 → …

Bibliographical note

Copyright The Electrochemical Society, Inc. [2007]. All rights reserved. Except as provided under U.S. copyright law, this work may not be reproduced, resold, distributed, or modified without the express permission of The Electrochemical Society (ECS).

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title = "Pulse Reversal PermAlloy Plating Process for MEMS Applications",

abstract = "Nickel-iron, and especially Permalloy, plating has been knownand used for more than 40 years, but there are still severalproblems related to stability and maintenance that should beresolved. This paper presents a saccharine-free pulse reversalplating Permalloy electrolyte, which gives low-stress deposits.We demonstrate selected MEMS applications of the electrolyte.The use of the strong complexing agent 5-sulfosalicylic acidallows for a photometric determination of the Fe3+-level in thebath and eliminate precipitates. This makes the electrolytesuitable as a Permalloy plating process used on an irregular basis.",

author = "Kristian Smistrup and Tang, {Peter Torben} and Per M{\o}ller",

note = "Copyright The Electrochemical Society, Inc. [2007]. All rights reserved. Except as provided under U.S. copyright law, this work may not be reproduced, resold, distributed, or modified without the express permission of The Electrochemical Society (ECS).; ECS Meeting : Magnetic Materials Processes, and Devices 9 ; Conference date: 01-01-2006",

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AU - Smistrup, Kristian

AU - Tang, Peter Torben

AU - Møller, Per

N1 - Conference code: 210th

PY - 2007

Y1 - 2007

N2 - Nickel-iron, and especially Permalloy, plating has been knownand used for more than 40 years, but there are still severalproblems related to stability and maintenance that should beresolved. This paper presents a saccharine-free pulse reversalplating Permalloy electrolyte, which gives low-stress deposits.We demonstrate selected MEMS applications of the electrolyte.The use of the strong complexing agent 5-sulfosalicylic acidallows for a photometric determination of the Fe3+-level in thebath and eliminate precipitates. This makes the electrolytesuitable as a Permalloy plating process used on an irregular basis.

AB - Nickel-iron, and especially Permalloy, plating has been knownand used for more than 40 years, but there are still severalproblems related to stability and maintenance that should beresolved. This paper presents a saccharine-free pulse reversalplating Permalloy electrolyte, which gives low-stress deposits.We demonstrate selected MEMS applications of the electrolyte.The use of the strong complexing agent 5-sulfosalicylic acidallows for a photometric determination of the Fe3+-level in thebath and eliminate precipitates. This makes the electrolytesuitable as a Permalloy plating process used on an irregular basis.

U2 - 10.1149/1.2753252

DO - 10.1149/1.2753252

M3 - Conference article

SN - 1938-5862

VL - 3

SP - 179

EP - 189

JO - E C S Transactions

JF - E C S Transactions

IS - 25

T2 - ECS Meeting : Magnetic Materials Processes, and Devices 9

Y2 - 1 January 2006

ER -

Pulse Reversal PermAlloy Plating Process for MEMS Applications

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