Pulse Plating on Gold Surfaces Studied by In Situ Scanning Tunneling Microscopy

Jens Enevold Thaulov Andersen; Gregers Bech-Nielsen; Per Møller

doi:10.1016/0257-8972(94)90114-7

Pulse Plating on Gold Surfaces Studied by In Situ Scanning Tunneling Microscopy

Jens Enevold Thaulov Andersen
, Gregers Bech-Nielsen
, Per Møller

Research output: Contribution to journal › Journal article › Research › peer-review

Abstract

Deposition of bulk copper on thin film gold surfaces is carried out by computer-aided pulse plating. It is demonstrated that the morphology of the copper deposit can be studied by in situ scanning tunnelling microscopy both in potentiostatic experiments and in galvanostatic experiments. Optimized procedures for obtaining smooth deposits by pulse plating are explained in terms of a levelling effect. Possible non-faradaic processes observed in measurements with high frequency pulse plating are discussed.

Original language	English
Journal	Surface and Coatings Technology
Volume	67
Issue number	3
Pages (from-to)	151-159
ISSN	0257-8972
DOIs	https://doi.org/10.1016/0257-8972(94)90114-7
Publication status	Published - 1994

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title = "Pulse Plating on Gold Surfaces Studied by In Situ Scanning Tunneling Microscopy",

abstract = "Deposition of bulk copper on thin film gold surfaces is carried out by computer-aided pulse plating. It is demonstrated that the morphology of the copper deposit can be studied by in situ scanning tunnelling microscopy both in potentiostatic experiments and in galvanostatic experiments. Optimized procedures for obtaining smooth deposits by pulse plating are explained in terms of a levelling effect. Possible non-faradaic processes observed in measurements with high frequency pulse plating are discussed. ",

keywords = "Corrosion",

author = "Andersen, \{Jens Enevold Thaulov\} and Gregers Bech-Nielsen and Per M{\o}ller",

year = "1994",

doi = "10.1016/0257-8972(94)90114-7",

language = "English",

volume = "67",

pages = "151--159",

journal = "Surface and Coatings Technology",

issn = "0257-8972",

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number = "3",

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TY - JOUR

T1 - Pulse Plating on Gold Surfaces Studied by In Situ Scanning Tunneling Microscopy

AU - Andersen, Jens Enevold Thaulov

AU - Bech-Nielsen, Gregers

AU - Møller, Per

PY - 1994

Y1 - 1994

N2 - Deposition of bulk copper on thin film gold surfaces is carried out by computer-aided pulse plating. It is demonstrated that the morphology of the copper deposit can be studied by in situ scanning tunnelling microscopy both in potentiostatic experiments and in galvanostatic experiments. Optimized procedures for obtaining smooth deposits by pulse plating are explained in terms of a levelling effect. Possible non-faradaic processes observed in measurements with high frequency pulse plating are discussed.

AB - Deposition of bulk copper on thin film gold surfaces is carried out by computer-aided pulse plating. It is demonstrated that the morphology of the copper deposit can be studied by in situ scanning tunnelling microscopy both in potentiostatic experiments and in galvanostatic experiments. Optimized procedures for obtaining smooth deposits by pulse plating are explained in terms of a levelling effect. Possible non-faradaic processes observed in measurements with high frequency pulse plating are discussed.

KW - Corrosion

U2 - 10.1016/0257-8972(94)90114-7

DO - 10.1016/0257-8972(94)90114-7

M3 - Journal article

SN - 0257-8972

VL - 67

SP - 151

EP - 159

JO - Surface and Coatings Technology

JF - Surface and Coatings Technology

IS - 3

ER -

Pulse Plating on Gold Surfaces Studied by In Situ Scanning Tunneling Microscopy

Abstract

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