Pulse Plating on Gold Surfaces Studied by In Situ Scanning Tunneling Microscopy

Jens Enevold Thaulov Andersen, Gregers Bech-Nielsen, Per Møller

    Research output: Contribution to journalJournal articleResearchpeer-review

    Abstract

    Deposition of bulk copper on thin film gold surfaces is carried out by computer-aided pulse plating. It is demonstrated that the morphology of the copper deposit can be studied by in situ scanning tunnelling microscopy both in potentiostatic experiments and in galvanostatic experiments. Optimized procedures for obtaining smooth deposits by pulse plating are explained in terms of a levelling effect. Possible non-faradaic processes observed in measurements with high frequency pulse plating are discussed.
    Original languageEnglish
    JournalSurface and Coatings Technology
    Volume67
    Issue number3
    Pages (from-to)151-159
    ISSN0257-8972
    DOIs
    Publication statusPublished - 1994

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