Pt-Thinfilm Metallization for Fluxless FC-Bonding Using
                SnPb(60/40) Solder Bump Metallurgy

Research output: Chapter in Book/Report/Conference proceeding › Book chapter › Research › peer-review

Original language	English
Title of host publication	11th European Microelectronics Conference
Publication date	1997
Pages	385-392
Publication status	Published - 1997
Event	11th European Microelectronics Conference - Venice, Italy Duration: 14 May 1997 → 16 May 1997 Conference number: 11

Conference	11th European Microelectronics Conference
Number	11
Country/Territory	Italy
City	Venice
Period	14/05/1997 → 16/05/1997

OpenUrl availability

@inbook{7b801c28f75a4bfab32b11e15f218e75,

title = "Pt-Thinfilm Metallization for Fluxless FC-Bonding Using SnPb(60/40) Solder Bump Metallurgy",

author = "Kuhmann, \{Jochen Friedrich\} and C.-H. Chiang and P. Harde and W. {\"O}sterle",

year = "1997",

language = "English",

pages = "385--392",

booktitle = "11th European Microelectronics Conference",

note = "11th European Microelectronics Conference ; Conference date: 14-05-1997 Through 16-05-1997",

}

TY - CHAP

T1 - Pt-Thinfilm Metallization for Fluxless FC-Bonding Using SnPb(60/40) Solder Bump Metallurgy

AU - Kuhmann, Jochen Friedrich

AU - Chiang, C.-H.

AU - Harde, P.

AU - Österle, W.

N1 - Conference code: 11

PY - 1997

Y1 - 1997

M3 - Book chapter

SP - 385

EP - 392

BT - 11th European Microelectronics Conference

T2 - 11th European Microelectronics Conference

Y2 - 14 May 1997 through 16 May 1997

ER -