Pt-Thinfilm Metallization for Fluxless FC-Bonding Using SnPb(60/40) Solder Bump Metallurgy

Jochen Friedrich Kuhmann, C.-H. Chiang, P. Harde, W. Österle

    Research output: Chapter in Book/Report/Conference proceedingBook chapterResearchpeer-review

    Original languageEnglish
    Title of host publication11th European Microelectronics Conference
    Publication date1997
    Pages385-392
    Publication statusPublished - 1997
    Event11th European Microelectronics Conference - Venice
    Duration: 1 Jan 1997 → …

    Conference

    Conference11th European Microelectronics Conference
    CityVenice
    Period01/01/1997 → …

    Cite this

    Kuhmann, J. F., Chiang, C-H., Harde, P., & Österle, W. (1997). Pt-Thinfilm Metallization for Fluxless FC-Bonding Using SnPb(60/40) Solder Bump Metallurgy. In 11th European Microelectronics Conference (pp. 385-392)