Pt thin-film metallization for FC-bonding using SnPb(60/40)
                solder bump metallurgy

Jochen Friedrich Kuhmann, C.-H. Chiang, P. Harde, F. Reier, W. Oesterle, I. Urban, A. Klein

Research output: Contribution to journal › Journal article › Research › peer-review

Original language	English
Journal	Materials Science & Engineering. A
Volume	242
Pages (from-to)	22-25
Publication status	Published - 1998

Cite this

@article{7f7f6fb4a3bb4661a32f5b54c730ee6b,

title = "Pt thin-film metallization for FC-bonding using SnPb(60/40) solder bump metallurgy",

author = "Kuhmann, {Jochen Friedrich} and C.-H. Chiang and P. Harde and F. Reier and W. Oesterle and I. Urban and A. Klein",

year = "1998",

language = "English",

volume = "242",

pages = "22--25",

journal = "Materials Science and Engineering: A - Structural Materials: Properties, Microstructure and Processing",

issn = "0921-5093",

publisher = "Elsevier",

}

TY - JOUR

T1 - Pt thin-film metallization for FC-bonding using SnPb(60/40) solder bump metallurgy

AU - Kuhmann, Jochen Friedrich

AU - Chiang, C.-H.

AU - Harde, P.

AU - Reier, F.

AU - Oesterle, W.

AU - Urban, I.

AU - Klein, A.

PY - 1998

Y1 - 1998

M3 - Journal article

VL - 242

SP - 22

EP - 25

JO - Materials Science and Engineering: A - Structural Materials: Properties, Microstructure and Processing

JF - Materials Science and Engineering: A - Structural Materials: Properties, Microstructure and Processing

SN - 0921-5093

ER -