Pt thin-film metallization for FC-bonding using SnPb(60/40) solder bump metallurgy

Jochen Friedrich Kuhmann, C.-H. Chiang, P. Harde, F. Reier, W. Oesterle, I. Urban, A. Klein

    Research output: Contribution to journalJournal articleResearchpeer-review

    Original languageEnglish
    JournalMaterials Science & Engineering. A
    Volume242
    Pages (from-to)22-25
    Publication statusPublished - 1998

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