Abstract
The effect of three common no-clean solder flux residues (adipic acid, glutaric acid, and succinic acid) as contamination types at three low levels (same concentrations) as well as in the same conductivity value in comparison with sodium chloride (NaCl) on time to failure (TTF) due to electrochemical migration (ECM) on the surface mount capacitors (SMCs) were investigated. The relation between TTF and leakage current (LC), conductivity, number of failures, as well as the probability of failure (PoF) using applicable probabilistic distributions in various conditions combined with diverse contamination types/levels and voltage based on many replications were studied.
| Original language | English |
|---|---|
| Title of host publication | 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) |
| Publisher | IEEE |
| Publication date | 2023 |
| Pages | 1-9 |
| ISBN (Electronic) | 978-91-89821-06-4 |
| DOIs | |
| Publication status | Published - 2023 |
| Event | 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) - Oslo, Norway Duration: 12 Jun 2023 → 14 Jun 2023 |
Conference
| Conference | 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) |
|---|---|
| Country/Territory | Norway |
| City | Oslo |
| Period | 12/06/2023 → 14/06/2023 |
Keywords
- Electrochemical migration
- Time to failure
- Probability of failure
- Surface mount capacitor
- Contamination type and level
- Conductivity