Precipitation driven nano-twinning: Simultaneous enhancement of mechanical and electrical properties in Cu-Ni-Sn alloys

Fei Yang, Canhui Wu, Ruifeng Li*, Yusong Xu, Lichu Zhou, Feng Fang, Liming Dong, Hyoung Seop Kim, Wenyi Huo, Tianbo Yu

*Corresponding author for this work

Research output: Contribution to journalJournal articleResearchpeer-review

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Abstract

After homogenization, hot forging and solid-solution treatment at 800 °C, the Cu-15Ni-9Sn alloy was cold-rolled to a 60 % thickness reduction and aged at 400 °C. After 1 h aging, spinodal decomposition produced the Sn and Ni enriched DO22 phase coherent with the matrix, while abundant nanotwins emerged in the vicinity of (Cu, Ni)3Sn precipitates in the recrystallized matrix. Compared to the as-rolled state, the alloy exhibited enhanced hardness (316 HV), ultimate tensile strength (1131 MPa), and electrical conductivity (9.7 % IACS). Extending aging to 4 h led to extensive (Cu, Ni)3Sn secondary phase formation and pronounced recrystallization, reducing strength to 855 MPa but increasing electrical conductivity to 11.7 % IACS and total elongation to 12.9 %. The synergistic interplay of spinodal decomposition, local recrystallization, precipitation and nano-twinning underpinned the superior mechanical and electrical properties of the 1 h aged Cu-15Ni-9Sn alloy.

Original languageEnglish
Article number116834
JournalScripta Materialia
Volume267
Number of pages7
ISSN1359-6462
DOIs
Publication statusPublished - 2025

Keywords

  • Copper alloys
  • Mechanical properties
  • Nano-twinning
  • Spinodal decomposition

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