Abstract
After homogenization, hot forging and solid-solution treatment at 800 °C, the Cu-15Ni-9Sn alloy was cold-rolled to a 60 % thickness reduction and aged at 400 °C. After 1 h aging, spinodal decomposition produced the Sn and Ni enriched DO22 phase coherent with the matrix, while abundant nanotwins emerged in the vicinity of (Cu, Ni)3Sn precipitates in the recrystallized matrix. Compared to the as-rolled state, the alloy exhibited enhanced hardness (316 HV), ultimate tensile strength (1131 MPa), and electrical conductivity (9.7 % IACS). Extending aging to 4 h led to extensive (Cu, Ni)3Sn secondary phase formation and pronounced recrystallization, reducing strength to 855 MPa but increasing electrical conductivity to 11.7 % IACS and total elongation to 12.9 %. The synergistic interplay of spinodal decomposition, local recrystallization, precipitation and nano-twinning underpinned the superior mechanical and electrical properties of the 1 h aged Cu-15Ni-9Sn alloy.
| Original language | English |
|---|---|
| Article number | 116834 |
| Journal | Scripta Materialia |
| Volume | 267 |
| Number of pages | 7 |
| ISSN | 1359-6462 |
| DOIs | |
| Publication status | Published - 2025 |
Keywords
- Copper alloys
- Mechanical properties
- Nano-twinning
- Spinodal decomposition