Polysilicon on Quartz Substrate for Silicide Based Row-Column CMUTs

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Abstract

This paper presents a new type of insulating substrate, polysilicon-on-quartz (POOQ), that can be used for wafer bonded capacitive micromachined ultrasonic transducers (CMUTs). The substrate is based on a quartz handle wafer on which a device layer of polysilicon is deposited. The polysilicon is polished to an average surface roughness below 0.2 nm which allows for wafer bonding. Fusion bonding of such wafers is successfully performed at 950 °C which opens up for new CMUT device designs including the use of silicides for low resistance large scale row-column addressed (RCA) ultrasound transducers.
Original languageEnglish
Title of host publicationProceedings of 2021 IEEE International Ultrasonics Symposium
Number of pages4
PublisherIEEE
Publication date2021
ISBN (Electronic)978-1-6654-0355-9
DOIs
Publication statusPublished - 2021
Event2021 IEEE International Ultrasonics Symposium - Virtual Symposium, Xi'an, China
Duration: 11 Sept 202116 Sept 2021
https://ieeexplore.ieee.org/xpl/conhome/9593294/proceeding
https://2021.ieee-ius.org/

Conference

Conference2021 IEEE International Ultrasonics Symposium
LocationVirtual Symposium
Country/TerritoryChina
CityXi'an
Period11/09/202116/09/2021
Internet address

Fingerprint

Dive into the research topics of 'Polysilicon on Quartz Substrate for Silicide Based Row-Column CMUTs'. Together they form a unique fingerprint.

Cite this