Polymer multilevel lab-on-chip systems for electrochemical sensing

Marco Matteucci, Simon Tylsgaard Larsen, Alessandro Garau, Simone Tanzi, Rafael J. Taboryski

    Research output: Contribution to journalJournal articleResearchpeer-review

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    Abstract

    The authors present a scheme intended for production of large quantities of lab on chip systems by means of Si dry etching, electroplating, injection molding, and pressure-assisted thermal bonding. This scheme allows for the fabrication of large numbers of samples having a combination of structures with depths as small as tens of nanometers and as big as hundreds of microns on the same polymer chip. The authors also describe in detail the fabrication procedure
    of polymer substrates with embedded Au and pedot:tosylate electrodes for electrochemical applications. The electrode fabrication process is simple and fit for integration in a production scheme. The electrode–substrates are then bonded to injection molded counterparts to be used for electrochemical applications. A dimensional and functional characterization of the electrodes is also presented here.
    Original languageEnglish
    JournalJournal of Vacuum Science and Technology. Part B. Microelectronics and Nanometer Structures
    Volume31
    Pages (from-to)06F904-1
    ISSN1071-1023
    DOIs
    Publication statusPublished - 2013

    Bibliographical note

    © 2013 American Vacuum Society

    Cite this

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    title = "Polymer multilevel lab-on-chip systems for electrochemical sensing",
    abstract = "The authors present a scheme intended for production of large quantities of lab on chip systems by means of Si dry etching, electroplating, injection molding, and pressure-assisted thermal bonding. This scheme allows for the fabrication of large numbers of samples having a combination of structures with depths as small as tens of nanometers and as big as hundreds of microns on the same polymer chip. The authors also describe in detail the fabrication procedureof polymer substrates with embedded Au and pedot:tosylate electrodes for electrochemical applications. The electrode fabrication process is simple and fit for integration in a production scheme. The electrode–substrates are then bonded to injection molded counterparts to be used for electrochemical applications. A dimensional and functional characterization of the electrodes is also presented here.",
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    Polymer multilevel lab-on-chip systems for electrochemical sensing. / Matteucci, Marco; Larsen, Simon Tylsgaard; Garau, Alessandro; Tanzi, Simone; Taboryski, Rafael J.

    In: Journal of Vacuum Science and Technology. Part B. Microelectronics and Nanometer Structures, Vol. 31, 2013, p. 06F904-1.

    Research output: Contribution to journalJournal articleResearchpeer-review

    TY - JOUR

    T1 - Polymer multilevel lab-on-chip systems for electrochemical sensing

    AU - Matteucci, Marco

    AU - Larsen, Simon Tylsgaard

    AU - Garau, Alessandro

    AU - Tanzi, Simone

    AU - Taboryski, Rafael J.

    N1 - © 2013 American Vacuum Society

    PY - 2013

    Y1 - 2013

    N2 - The authors present a scheme intended for production of large quantities of lab on chip systems by means of Si dry etching, electroplating, injection molding, and pressure-assisted thermal bonding. This scheme allows for the fabrication of large numbers of samples having a combination of structures with depths as small as tens of nanometers and as big as hundreds of microns on the same polymer chip. The authors also describe in detail the fabrication procedureof polymer substrates with embedded Au and pedot:tosylate electrodes for electrochemical applications. The electrode fabrication process is simple and fit for integration in a production scheme. The electrode–substrates are then bonded to injection molded counterparts to be used for electrochemical applications. A dimensional and functional characterization of the electrodes is also presented here.

    AB - The authors present a scheme intended for production of large quantities of lab on chip systems by means of Si dry etching, electroplating, injection molding, and pressure-assisted thermal bonding. This scheme allows for the fabrication of large numbers of samples having a combination of structures with depths as small as tens of nanometers and as big as hundreds of microns on the same polymer chip. The authors also describe in detail the fabrication procedureof polymer substrates with embedded Au and pedot:tosylate electrodes for electrochemical applications. The electrode fabrication process is simple and fit for integration in a production scheme. The electrode–substrates are then bonded to injection molded counterparts to be used for electrochemical applications. A dimensional and functional characterization of the electrodes is also presented here.

    U2 - 10.1116/1.4832415

    DO - 10.1116/1.4832415

    M3 - Journal article

    VL - 31

    SP - 06F904-1

    JO - Journal of Vacuum Science and Technology. Part B. Microelectronics and Nanometer Structures

    JF - Journal of Vacuum Science and Technology. Part B. Microelectronics and Nanometer Structures

    SN - 1071-1023

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