Polycrystal deformation and single crystal deformation: Dislocation structure and flow stress in copper

X. Huang; A. Borrego; W. Pantleon

doi:10.1016/S0921-5093(01)01019-X

Polycrystal deformation and single crystal deformation: Dislocation structure and flow stress in copper

X. Huang, A. Borrego, W. Pantleon

Research output: Contribution to journal › Conference article › Research › peer-review

Abstract

The relation between the polycrystal deformation and single crystal deformation has been studied for pure polycrystalline copper deformed in tension. The dislocation microstructure has been analyzed for grains of different orientation by transmission electron microscopy (TEM) and three types of microstructures have been identified. A correlation is found between microstructure and grain orientation, which agrees well with earlier observations in tensile deformed aluminum polycrystals and copper single crystals. The stress–strain curve of the copper polycrystal is calculated with good accuracy from single crystal data, which are weighted according to the volume fractions of the three different types based on a quantitative texture measurement of the polycrystal.

Original language	English
Journal	Materials Science and Engineering: A - Structural Materials: Properties, Microstructure and Processing
Volume	319-321
Issue number	SI
Pages (from-to)	237-241
ISSN	0921-5093
DOIs	https://doi.org/10.1016/S0921-5093(01)01019-X
Publication status	Published - 2001
Event	12th International Conference on the Strength of Materials - Asilomar, CA, United States Duration: 27 Aug 2000 → 1 Sep 2000

Conference

Conference	12th International Conference on the Strength of Materials
Country/Territory	United States
City	Asilomar, CA
Period	27/08/2000 → 01/09/2000

Keywords

Dislocation structure
Grain orientation
Stress-strain curve

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10.1016/S0921-5093(01)01019-X

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title = "Polycrystal deformation and single crystal deformation: Dislocation structure and flow stress in copper",

abstract = "The relation between the polycrystal deformation and single crystal deformation has been studied for pure polycrystalline copper deformed in tension. The dislocation microstructure has been analyzed for grains of different orientation by transmission electron microscopy (TEM) and three types of microstructures have been identified. A correlation is found between microstructure and grain orientation, which agrees well with earlier observations in tensile deformed aluminum polycrystals and copper single crystals. The stress–strain curve of the copper polycrystal is calculated with good accuracy from single crystal data, which are weighted according to the volume fractions of the three different types based on a quantitative texture measurement of the polycrystal.",

keywords = "5-I nano, Dislocation structure, Grain orientation, Stress-strain curve",

author = "X. Huang and A. Borrego and W. Pantleon",

year = "2001",

doi = "10.1016/S0921-5093(01)01019-X",

language = "English",

volume = "319-321",

pages = "237--241",

journal = "Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing",

issn = "0921-5093",

publisher = "Elsevier",

number = "SI",

note = "12th International Conference on the Strength of Materials, ICSMA-12 ; Conference date: 27-08-2000 Through 01-09-2000",

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Polycrystal deformation and single crystal deformation: Dislocation structure and flow stress in copper. / Huang, X.; Borrego, A.; Pantleon, W.

In: Materials Science and Engineering: A - Structural Materials: Properties, Microstructure and Processing, Vol. 319-321, No. SI, 2001, p. 237-241.

Research output: Contribution to journal › Conference article › Research › peer-review

TY - GEN

T1 - Polycrystal deformation and single crystal deformation: Dislocation structure and flow stress in copper

AU - Huang, X.

AU - Borrego, A.

AU - Pantleon, W.

PY - 2001

Y1 - 2001

N2 - The relation between the polycrystal deformation and single crystal deformation has been studied for pure polycrystalline copper deformed in tension. The dislocation microstructure has been analyzed for grains of different orientation by transmission electron microscopy (TEM) and three types of microstructures have been identified. A correlation is found between microstructure and grain orientation, which agrees well with earlier observations in tensile deformed aluminum polycrystals and copper single crystals. The stress–strain curve of the copper polycrystal is calculated with good accuracy from single crystal data, which are weighted according to the volume fractions of the three different types based on a quantitative texture measurement of the polycrystal.

AB - The relation between the polycrystal deformation and single crystal deformation has been studied for pure polycrystalline copper deformed in tension. The dislocation microstructure has been analyzed for grains of different orientation by transmission electron microscopy (TEM) and three types of microstructures have been identified. A correlation is found between microstructure and grain orientation, which agrees well with earlier observations in tensile deformed aluminum polycrystals and copper single crystals. The stress–strain curve of the copper polycrystal is calculated with good accuracy from single crystal data, which are weighted according to the volume fractions of the three different types based on a quantitative texture measurement of the polycrystal.

KW - 5-I nano

KW - Dislocation structure

KW - Grain orientation

KW - Stress-strain curve

U2 - 10.1016/S0921-5093(01)01019-X

DO - 10.1016/S0921-5093(01)01019-X

M3 - Conference article

VL - 319-321

SP - 237

EP - 241

JO - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing

JF - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing

SN - 0921-5093

IS - SI

T2 - 12th International Conference on the Strength of Materials

Y2 - 27 August 2000 through 1 September 2000

ER -

Polycrystal deformation and single crystal deformation: Dislocation structure and flow stress in copper

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Keywords

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