Polycrystal deformation and single crystal deformation: Dislocation structure and flow stress in copper

X. Huang, A. Borrego, W. Pantleon

    Research output: Contribution to journalConference articleResearchpeer-review

    Abstract

    The relation between the polycrystal deformation and single crystal deformation has been studied for pure polycrystalline copper deformed in tension. The dislocation microstructure has been analyzed for grains of different orientation by transmission electron microscopy (TEM) and three types of microstructures have been identified. A correlation is found between microstructure and grain orientation, which agrees well with earlier observations in tensile deformed aluminum polycrystals and copper single crystals. The stress–strain curve of the copper polycrystal is calculated with good accuracy from single crystal data, which are weighted according to the volume fractions of the three different types based on a quantitative texture measurement of the polycrystal.
    Original languageEnglish
    JournalMaterials Science and Engineering: A - Structural Materials: Properties, Microstructure and Processing
    Volume319-321
    Issue numberSI
    Pages (from-to)237-241
    ISSN0921-5093
    DOIs
    Publication statusPublished - 2001
    Event12th International Conference on the Strength of Materials - Asilomar, CA, United States
    Duration: 27 Aug 20001 Sep 2000

    Conference

    Conference12th International Conference on the Strength of Materials
    CountryUnited States
    CityAsilomar, CA
    Period27/08/200001/09/2000

    Keywords

    • Dislocation structure
    • Grain orientation
    • Stress-strain curve

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