Point-Bonded electrospun polystyrene fibrous mats fabricated via the addition of poly (butylacrylate) adhesive

Dae Kwang Park, Soo-Jin Park, Baek Woo-il, Muzafar Ahmed Kanjwal, Hak Yong Kim

Research output: Contribution to journalJournal articleResearchpeer-review

Abstract

Because of poor mechanical strength, applications of electrospun polystyrene (PS) fibrous mats are quite limited. The introduction of various concentrations of poly (butylacrylate) adhesives (PBAs) into PS solutions led to the fabrication of point-bonded electrospun PS fibrous mats with good mechanical strength. The morphologies of PS/PBA fibers with varying PBA content (0-50 wt%) were investigated using scanning electron microscopy (SEM), and the results were compared with pure PS and PBA fibers fabricated with various solvents. SEM images indicated that point-bonded PS/PBA fibers were uniformly distributed with an average diameter of 1-2 On increasing concentration of PBA up to 20 wt%, porous PS/PBA fibrous mats were obtained. However, solid films were formed at very high concentrations of PBA. The Young's modulus and tensile strength of PS/PBA fibrous mats increased up to 52.4 and 2.7 MPa, respectively. The resultant enhancement of the mechanical properties of PS fibrous mats on addition of PBA increases the number of potential applications of these materials. POLYM. ENG. SCI., 51:894-901, 2011. (C) 2011 Society of Plastics Engineers
Original languageEnglish
JournalPolymer Engineering and Science
Volume51
Issue number5
Pages (from-to)894-901
ISSN0032-3888
DOIs
Publication statusAccepted/In press - 2011
Externally publishedYes

Fingerprint Dive into the research topics of 'Point-Bonded electrospun polystyrene fibrous mats fabricated via the addition of poly (butylacrylate) adhesive'. Together they form a unique fingerprint.

Cite this