TY - JOUR
T1 - PMMA to SU-8 bonding for polymer based lab-on-a-chip systems with integrated optics
AU - Olsen, Brian Bilenberg
AU - Nielsen, Theodor
AU - Clausen, Bjarne Hans
AU - Kristensen, Anders
PY - 2004
Y1 - 2004
N2 - We present an adhesive bonding technique developed for SU-8 based "lab-on-a-chip"- systems with integrated optical components. Microfluidic channels and
optical components (e.g. wave-guides) are defined in SU-8 photoresist on a Pyrex glass substrate. The microfluidic channels are sealed by a second Pyrex substrate, bonded on top of the cross-linked SU-8 structure using an inter-
mediate layer of 950K molecular weight poly-methylmethacrylate (PMMA). Due to
a lower refractive index of PMMA, this bonding technique offers optical waveguiding in the SU-8 structures in combination with good sealing of the
microfluidic channels. The bonding technique is investigated with respect to bonding temperature in the range of 50 - 150 degr. C and at bonding forces
of 1000 N and 2000 N on a 4-inch wafer. A maximum bonding strength of 16 MPa is achieved for the PMMA to SU-8 bonding at a bonding temperature of 110 degr. C
and at a bonding force of 2000 N. Furthermore 950K PMMA shows no tendency to
flow into the microfluidic channels due to its high viscosity.
AB - We present an adhesive bonding technique developed for SU-8 based "lab-on-a-chip"- systems with integrated optical components. Microfluidic channels and
optical components (e.g. wave-guides) are defined in SU-8 photoresist on a Pyrex glass substrate. The microfluidic channels are sealed by a second Pyrex substrate, bonded on top of the cross-linked SU-8 structure using an inter-
mediate layer of 950K molecular weight poly-methylmethacrylate (PMMA). Due to
a lower refractive index of PMMA, this bonding technique offers optical waveguiding in the SU-8 structures in combination with good sealing of the
microfluidic channels. The bonding technique is investigated with respect to bonding temperature in the range of 50 - 150 degr. C and at bonding forces
of 1000 N and 2000 N on a 4-inch wafer. A maximum bonding strength of 16 MPa is achieved for the PMMA to SU-8 bonding at a bonding temperature of 110 degr. C
and at a bonding force of 2000 N. Furthermore 950K PMMA shows no tendency to
flow into the microfluidic channels due to its high viscosity.
U2 - 10.1088/0960-1317/14/6/008
DO - 10.1088/0960-1317/14/6/008
M3 - Journal article
SN - 0960-1317
VL - 14
SP - 814
EP - 818
JO - Journal of Micromechanics and Microengineering
JF - Journal of Micromechanics and Microengineering
IS - 6
ER -