Plasmonic nanopillar structures for surface-enhanced raman scattering applications

Tomas Rindzevicius, Michael Stenbæk Schmidt, Kaiyu Wu, Anil Haraksingh Thilsted, Rikke Kragh Lauridsen, Tommy Sonne Alstrøm, M. Palla, J. Yang, Anja Boisen

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

    Abstract

    Noble metal nanostructures support localized surface plasmon (LSPR) resonances that depend on their dimensions, shapes and compositions. Particle LSPR's can be used to spatially confine the incident light and produce enormous electromagnetic (EM) field enhancement spots, i.e. hot spots. Hot spots have been utilized in surfaceenhanced Raman spectroscopy (SERS) for biological and chemical sensing. We present Au nanopillar (NP) SERS structures that are excellent for molecular detection. The NP structures can be fabricated using a simple two-step process. We analyze NP optical properties experimentally and theoretically. Simulations show that that a single Agcoated NP supports two LSPR modes, i.e. the particle mode and the Ag cap resonant cavity mode. The Ag cap resonant cavity mode contributes most to the enhancement of the Raman scattering signal. The electric field distribution calculations show that the EM hot spots are located at the bottom of the Ag cap which is important observation for practical SERS sensing. Reproducible and repeatable SERS signal intensities can be obtained across large surface areas (>mm2). Application examples include detection of TAMRA-labeled vasopressin and cyanide (KCN).
    Original languageEnglish
    Title of host publicationTechconnect Briefs 2016
    Number of pages4
    Volume4
    Publication date2016
    Pages243-246
    ISBN (Electronic)9780997511734
    Publication statusPublished - 2016
    Event10th Annual TechConnect World Innovation Conference and Expo - Washington, United States
    Duration: 22 May 201625 May 2016
    Conference number: 10
    http://www.techconnectworld.com/World2016/

    Conference

    Conference10th Annual TechConnect World Innovation Conference and Expo
    Number10
    Country/TerritoryUnited States
    CityWashington
    Period22/05/201625/05/2016
    Internet address

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