Physical masking process for integrating micro metallic structures on polymer substrate: Physical mask

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Abstract

Integration of micro metallic structures in polymer devices is a broad multi-disciplinary research field, consisting of various combinations of mechanical, chemical and physical fabrication methods. Each of the methods has its specific advantages and disadvantages. Some applications like surface plasmon devices need micro metallic structures on a polymer substrate with an uniform metal layer thickness in the nanometer range. A well known fabrication process to achieve such metallic surface pattern on polymer substrate is photolithography which involves an expensive mask and toxic chemicals. The current study shows a novel approach for fabricating thin micro metallic structures on polymer substrates using a simple physical mask and a PVD equipment. The new process involves fewer process steps, it is cost effective and suitable for high volume industrial production. Current study suggests that physical masking process in combination with PVD can be a cost effective alternative to photolithography when thin metallic structures on a polymers substrate are concerned.
Original languageEnglish
Title of host publication9th International Conference of European Society of Precision Engineering and Nanotechnology : EUSPEN
Number of pages557
Volume2nd
Place of PublicationAustria
PublisherEuspen-Copy & Druck
Publication date2009
Edition1st
Pages22-25
ISBN (Print)978-0-9553082-6-0
Publication statusPublished - 2009
Event10th International Conference of the European Society for Precision Engineering and Nanotechnology - Zürich, Switzerland
Duration: 18 May 200822 May 2008
Conference number: 10

Conference

Conference10th International Conference of the European Society for Precision Engineering and Nanotechnology
Number10
CountrySwitzerland
CityZürich
Period18/05/200822/05/2008

Cite this

Islam, M. A., & Hansen, H. N. (2009). Physical masking process for integrating micro metallic structures on polymer substrate: Physical mask. In 9th International Conference of European Society of Precision Engineering and Nanotechnology: EUSPEN (1st ed., Vol. 2nd, pp. 22-25). Euspen-Copy & Druck.