Thick photoresist coating for electrode patterning in anisotropically etched v-grooves is investigated. The photoresist coverage is compared with and without soft baking. Two-step exposure is applied for a complete exposure and minimizing the resolution loss.
|Title of host publication||Proceedings, OFC|
|Publication status||Published - 2009|
|Event||2009 Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference, OFC/NFOEC - San Diego, CA, United States|
Duration: 22 Mar 2009 → 26 Mar 2009
|Conference||2009 Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference, OFC/NFOEC|
|City||San Diego, CA|
|Period||22/03/2009 → 26/03/2009|
Bibliographical noteCopyright: 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE
Wei, L., Khomtchenko, E., Alkeskjold, T. T., & Bjarklev, A. O. (2009). Photolithography of thick photoresist coating in anisotropically etched V-grooves for electrically controlled liquid crystal photonic bandgap fiber devices. In Proceedings, OFC (pp. 1-3). IEEE.