Perspectives on the climatic reliability issues of electronic devices

Rajan Ambat; Morten Stendahl Jellesen; Vadimas Verdingovas; Kamila Piotrowska; Helene Conseil

Perspectives on the climatic reliability issues of electronic devices

Rajan Ambat, Morten Stendahl Jellesen, Vadimas Verdingovas, Kamila Piotrowska, Helene Conseil

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Abstract

This paper provides a short overview of the climatic reliability issues of electronic de-vices and components with a focus on the metals/alloys usage on PCBA surface to-gether with cleanliness issues, humidity interaction on PCBA surface, and PCBA de-sign and device design aspects.

Original language	English
Title of host publication	Proceedings of EuroCorr 2014
Number of pages	6
Publication date	2014
Publication status	Published - 2014
Event	European Corrosion Congress - Palazzo dei Congressi of Pisa, Pisa, Italy Duration: 8 Sept 2014 → 12 Sept 2014 http://www.eurocorr2014.org/scope.htm

Conference

Conference	European Corrosion Congress
Location	Palazzo dei Congressi of Pisa
Country/Territory	Italy
City	Pisa
Period	08/09/2014 → 12/09/2014
Internet address	http://www.eurocorr2014.org/scope.htm

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@inproceedings{84a9360d9799426f8c0d354dcaaf1027,

title = "Perspectives on the climatic reliability issues of electronic devices",

abstract = "This paper provides a short overview of the climatic reliability issues of electronic de-vices and components with a focus on the metals/alloys usage on PCBA surface to-gether with cleanliness issues, humidity interaction on PCBA surface, and PCBA de-sign and device design aspects.",

author = "Rajan Ambat and Jellesen, {Morten Stendahl} and Vadimas Verdingovas and Kamila Piotrowska and Helene Conseil",

year = "2014",

language = "English",

booktitle = "Proceedings of EuroCorr 2014",

note = "European Corrosion Congress, EuroCorr 2014 ; Conference date: 08-09-2014 Through 12-09-2014",

url = "http://www.eurocorr2014.org/scope.htm",

}

TY - GEN

T1 - Perspectives on the climatic reliability issues of electronic devices

AU - Ambat, Rajan

AU - Jellesen, Morten Stendahl

AU - Verdingovas, Vadimas

AU - Piotrowska, Kamila

AU - Conseil, Helene

PY - 2014

Y1 - 2014

N2 - This paper provides a short overview of the climatic reliability issues of electronic de-vices and components with a focus on the metals/alloys usage on PCBA surface to-gether with cleanliness issues, humidity interaction on PCBA surface, and PCBA de-sign and device design aspects.

AB - This paper provides a short overview of the climatic reliability issues of electronic de-vices and components with a focus on the metals/alloys usage on PCBA surface to-gether with cleanliness issues, humidity interaction on PCBA surface, and PCBA de-sign and device design aspects.

M3 - Article in proceedings

BT - Proceedings of EuroCorr 2014

T2 - European Corrosion Congress

Y2 - 8 September 2014 through 12 September 2014

ER -

Perspectives on the climatic reliability issues of electronic devices

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