Perspectives on climatic reliability of electronic devices and components

Research output: Contribution to conferencePaperResearch

Abstract

The miniaturization of electronic systems and the explosive increase in their usage has increased the climatic reliability issues of electronics devices and components especially having metal/alloys parts exposed on the Printed Circuit Board Assembly (PCBA) surface or embedded within the multi-layer laminate. Problems are compounded by the fact that these systems are built by multi-material combinations and additional accelerating factors such as corrosion causing process related residues, bias voltage, and unpredictable user environment. Demand for miniaturised device has resulted in higher density packing with reduction in component size and closer spacing thereby increasing the electric field, while thinner metallic parts needs only nano-grams levels of metal loss for causing corrosion failures. This paper provides an overview of the climatic reliability issues of electronic devices and components with a focus on the metals/alloys usage on PCBA surface together with cleanliness issues, humidity interaction on PCBA surface, and PCBA design and device design aspects.
Original languageEnglish
Publication date2012
Number of pages18
Publication statusPublished - 2012
EventIMAPS Nordic Annual Conference Proceedings 2012 - Helsingør, Denmark
Duration: 2 Sep 20124 Sep 2012

Conference

ConferenceIMAPS Nordic Annual Conference Proceedings 2012
CountryDenmark
CityHelsingør
Period02/09/201204/09/2012

Keywords

  • Atmospheric humidity
  • Corrosion
  • Electric fields
  • Electronic equipment
  • Printed circuit boards
  • Surfaces
  • Thermoelectric equipment
  • Reliability

Fingerprint Dive into the research topics of 'Perspectives on climatic reliability of electronic devices and components'. Together they form a unique fingerprint.

Cite this