PCB Embedded Inductor for High-Frequency ZVS SEPIC Converter

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedings – Annual report year: 2018Researchpeer-review

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The volume and temperature rise of passive components, especially inductors, limit the momentum toward high power density in high-frequency power converters. To address the limitations, PCB integration of passive components should be considered with the benefit of low profile, excellent thermal characteristic and cost reduction. This paper investigates
an embedded structure of inductors to further increase the power density of a low power DC-DC converter. A pair of coupling inductors have been embedded into the PCB. The detailed embedded process has been described and the characteristics of
embedded inductor and design consideration are discussed. A 2MHz SEPIC converter working in ZVS turn-on with embedded
inductors is built to verify the effectiveness of the embedded structure.
Original languageEnglish
Title of host publicationProceedings of 2018 IEEE Applied Power Electronics Conference and Exposition
PublisherIEEE
Publication date2018
Pages98-104
ISBN (Print)978-1-5386-1180-7
Publication statusPublished - 2018
Event2018 IEEE Applied Power Electronics Conference and Exposition - Henry B. Gonzalez Convention Center, San Antonio, United States
Duration: 4 Mar 20188 Mar 2018

Conference

Conference2018 IEEE Applied Power Electronics Conference and Exposition
LocationHenry B. Gonzalez Convention Center
CountryUnited States
CitySan Antonio
Period04/03/201808/03/2018
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