PCB Embedded Inductor for High-Frequency ZVS SEPIC Converter

Yi Dou; Ziwei Ouyang; Prasanth Thummala; Michael A. E. Andersen

PCB Embedded Inductor for High-Frequency ZVS SEPIC Converter

Yi Dou, Ziwei Ouyang, Prasanth Thummala, Michael A. E. Andersen

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

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Abstract

The volume and temperature rise of passive components, especially inductors, limit the momentum toward high power density in high-frequency power converters. To address the limitations, PCB integration of passive components should be considered with the benefit of low profile, excellent thermal characteristic and cost reduction. This paper investigates
an embedded structure of inductors to further increase the power density of a low power DC-DC converter. A pair of coupling inductors have been embedded into the PCB. The detailed embedded process has been described and the characteristics of
embedded inductor and design consideration are discussed. A 2MHz SEPIC converter working in ZVS turn-on with embedded
inductors is built to verify the effectiveness of the embedded structure.

Original language	English
Title of host publication	Proceedings of 2018 IEEE Applied Power Electronics Conference and Exposition
Publisher	IEEE
Publication date	2018
Pages	98-104
ISBN (Print)	978-1-5386-1180-7
Publication status	Published - 2018
Event	2018 IEEE Applied Power Electronics Conference and Exposition - Henry B. Gonzalez Convention Center, San Antonio, United States Duration: 4 Mar 2018 → 8 Mar 2018 https://ieeexplore.ieee.org/xpl/conhome/8336027/proceeding

Conference

Conference	2018 IEEE Applied Power Electronics Conference and Exposition
Location	Henry B. Gonzalez Convention Center
Country/Territory	United States
City	San Antonio
Period	04/03/2018 → 08/03/2018
Internet address	https://ieeexplore.ieee.org/xpl/conhome/8336027/proceeding

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@inproceedings{61e5f88d95de44028c56de0743adbc91,

title = "PCB Embedded Inductor for High-Frequency ZVS SEPIC Converter",

abstract = "The volume and temperature rise of passive components, especially inductors, limit the momentum toward high power density in high-frequency power converters. To address the limitations, PCB integration of passive components should be considered with the benefit of low profile, excellent thermal characteristic and cost reduction. This paper investigatesan embedded structure of inductors to further increase the power density of a low power DC-DC converter. A pair of coupling inductors have been embedded into the PCB. The detailed embedded process has been described and the characteristics ofembedded inductor and design consideration are discussed. A 2MHz SEPIC converter working in ZVS turn-on with embeddedinductors is built to verify the effectiveness of the embedded structure.",

author = "Yi Dou and Ziwei Ouyang and Prasanth Thummala and Andersen, {Michael A. E.}",

year = "2018",

language = "English",

isbn = "978-1-5386-1180-7",

pages = "98--104",

booktitle = "Proceedings of 2018 IEEE Applied Power Electronics Conference and Exposition",

publisher = "IEEE",

address = "United States",

note = "2018 IEEE Applied Power Electronics Conference and Exposition, APEC 2018 ; Conference date: 04-03-2018 Through 08-03-2018",

url = "https://ieeexplore.ieee.org/xpl/conhome/8336027/proceeding",

}

TY - GEN

T1 - PCB Embedded Inductor for High-Frequency ZVS SEPIC Converter

AU - Dou, Yi

AU - Ouyang, Ziwei

AU - Thummala, Prasanth

AU - Andersen, Michael A. E.

PY - 2018

Y1 - 2018

N2 - The volume and temperature rise of passive components, especially inductors, limit the momentum toward high power density in high-frequency power converters. To address the limitations, PCB integration of passive components should be considered with the benefit of low profile, excellent thermal characteristic and cost reduction. This paper investigatesan embedded structure of inductors to further increase the power density of a low power DC-DC converter. A pair of coupling inductors have been embedded into the PCB. The detailed embedded process has been described and the characteristics ofembedded inductor and design consideration are discussed. A 2MHz SEPIC converter working in ZVS turn-on with embeddedinductors is built to verify the effectiveness of the embedded structure.

AB - The volume and temperature rise of passive components, especially inductors, limit the momentum toward high power density in high-frequency power converters. To address the limitations, PCB integration of passive components should be considered with the benefit of low profile, excellent thermal characteristic and cost reduction. This paper investigatesan embedded structure of inductors to further increase the power density of a low power DC-DC converter. A pair of coupling inductors have been embedded into the PCB. The detailed embedded process has been described and the characteristics ofembedded inductor and design consideration are discussed. A 2MHz SEPIC converter working in ZVS turn-on with embeddedinductors is built to verify the effectiveness of the embedded structure.

M3 - Article in proceedings

SN - 978-1-5386-1180-7

SP - 98

EP - 104

BT - Proceedings of 2018 IEEE Applied Power Electronics Conference and Exposition

PB - IEEE

T2 - 2018 IEEE Applied Power Electronics Conference and Exposition

Y2 - 4 March 2018 through 8 March 2018

ER -

PCB Embedded Inductor for High-Frequency ZVS SEPIC Converter

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