PCB Embedded Inductor for High-Frequency ZVS SEPIC Converter

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

3 Downloads (Pure)

Abstract

The volume and temperature rise of passive components, especially inductors, limit the momentum toward high power density in high-frequency power converters. To address the limitations, PCB integration of passive components should be considered with the benefit of low profile, excellent thermal characteristic and cost reduction. This paper investigates
an embedded structure of inductors to further increase the power density of a low power DC-DC converter. A pair of coupling inductors have been embedded into the PCB. The detailed embedded process has been described and the characteristics of
embedded inductor and design consideration are discussed. A 2MHz SEPIC converter working in ZVS turn-on with embedded
inductors is built to verify the effectiveness of the embedded structure.
Original languageEnglish
Title of host publicationProceedings of 2018 IEEE Applied Power Electronics Conference and Exposition
PublisherIEEE
Publication date2018
Pages98-104
ISBN (Print)978-1-5386-1180-7
Publication statusPublished - 2018
Event2018 IEEE Applied Power Electronics Conference and Exposition - Henry B. Gonzalez Convention Center, San Antonio, United States
Duration: 4 Mar 20188 Mar 2018

Conference

Conference2018 IEEE Applied Power Electronics Conference and Exposition
LocationHenry B. Gonzalez Convention Center
CountryUnited States
CitySan Antonio
Period04/03/201808/03/2018

Cite this

Dou, Y., Ouyang, Z., Thummala, P., & Andersen, M. A. E. (2018). PCB Embedded Inductor for High-Frequency ZVS SEPIC Converter. In Proceedings of 2018 IEEE Applied Power Electronics Conference and Exposition (pp. 98-104). IEEE.
Dou, Yi ; Ouyang, Ziwei ; Thummala, Prasanth ; Andersen, Michael A. E. / PCB Embedded Inductor for High-Frequency ZVS SEPIC Converter. Proceedings of 2018 IEEE Applied Power Electronics Conference and Exposition. IEEE, 2018. pp. 98-104
@inproceedings{61e5f88d95de44028c56de0743adbc91,
title = "PCB Embedded Inductor for High-Frequency ZVS SEPIC Converter",
abstract = "The volume and temperature rise of passive components, especially inductors, limit the momentum toward high power density in high-frequency power converters. To address the limitations, PCB integration of passive components should be considered with the benefit of low profile, excellent thermal characteristic and cost reduction. This paper investigatesan embedded structure of inductors to further increase the power density of a low power DC-DC converter. A pair of coupling inductors have been embedded into the PCB. The detailed embedded process has been described and the characteristics ofembedded inductor and design consideration are discussed. A 2MHz SEPIC converter working in ZVS turn-on with embeddedinductors is built to verify the effectiveness of the embedded structure.",
author = "Yi Dou and Ziwei Ouyang and Prasanth Thummala and Andersen, {Michael A. E.}",
year = "2018",
language = "English",
isbn = "978-1-5386-1180-7",
pages = "98--104",
booktitle = "Proceedings of 2018 IEEE Applied Power Electronics Conference and Exposition",
publisher = "IEEE",
address = "United States",

}

Dou, Y, Ouyang, Z, Thummala, P & Andersen, MAE 2018, PCB Embedded Inductor for High-Frequency ZVS SEPIC Converter. in Proceedings of 2018 IEEE Applied Power Electronics Conference and Exposition. IEEE, pp. 98-104, 2018 IEEE Applied Power Electronics Conference and Exposition, San Antonio, United States, 04/03/2018.

PCB Embedded Inductor for High-Frequency ZVS SEPIC Converter. / Dou, Yi; Ouyang, Ziwei; Thummala, Prasanth; Andersen, Michael A. E.

Proceedings of 2018 IEEE Applied Power Electronics Conference and Exposition. IEEE, 2018. p. 98-104.

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

TY - GEN

T1 - PCB Embedded Inductor for High-Frequency ZVS SEPIC Converter

AU - Dou, Yi

AU - Ouyang, Ziwei

AU - Thummala, Prasanth

AU - Andersen, Michael A. E.

PY - 2018

Y1 - 2018

N2 - The volume and temperature rise of passive components, especially inductors, limit the momentum toward high power density in high-frequency power converters. To address the limitations, PCB integration of passive components should be considered with the benefit of low profile, excellent thermal characteristic and cost reduction. This paper investigatesan embedded structure of inductors to further increase the power density of a low power DC-DC converter. A pair of coupling inductors have been embedded into the PCB. The detailed embedded process has been described and the characteristics ofembedded inductor and design consideration are discussed. A 2MHz SEPIC converter working in ZVS turn-on with embeddedinductors is built to verify the effectiveness of the embedded structure.

AB - The volume and temperature rise of passive components, especially inductors, limit the momentum toward high power density in high-frequency power converters. To address the limitations, PCB integration of passive components should be considered with the benefit of low profile, excellent thermal characteristic and cost reduction. This paper investigatesan embedded structure of inductors to further increase the power density of a low power DC-DC converter. A pair of coupling inductors have been embedded into the PCB. The detailed embedded process has been described and the characteristics ofembedded inductor and design consideration are discussed. A 2MHz SEPIC converter working in ZVS turn-on with embeddedinductors is built to verify the effectiveness of the embedded structure.

M3 - Article in proceedings

SN - 978-1-5386-1180-7

SP - 98

EP - 104

BT - Proceedings of 2018 IEEE Applied Power Electronics Conference and Exposition

PB - IEEE

ER -

Dou Y, Ouyang Z, Thummala P, Andersen MAE. PCB Embedded Inductor for High-Frequency ZVS SEPIC Converter. In Proceedings of 2018 IEEE Applied Power Electronics Conference and Exposition. IEEE. 2018. p. 98-104