Abstract
The potential of contact passivation for increasing cell performance is indicated by several results reported in the literature. However, scant characterization of the tunneling layers used for that purpose has been reported. In this paper, contact passivation is investigated by insertion of an ultra-thin AlOx layer between an n-type emitter and a Ti/Pd/Ag contact. By using a 1.5nm thick layer, an increase of the minority carrier lifetime by a factor of 2.7 is achieved. Since current-voltage measurements indicate that an ohmic behavior is conserved for AlOx layers as thick as 1.5nm, a 1.5nm AlOx layer is found to be a candidate of choice for contact passivation.
Original language | English |
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Journal | Energy Procedia |
Volume | 21 |
Pages (from-to) | 75-83 |
ISSN | 1876-6102 |
DOIs | |
Publication status | Published - 2011 |
Event | 3rd Workshop on Metallization for Crystalline Silicon Solar Cells - Charleroi, Belgium Duration: 25 Oct 2011 → 26 Oct 2011 |
Conference
Conference | 3rd Workshop on Metallization for Crystalline Silicon Solar Cells |
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Country/Territory | Belgium |
City | Charleroi |
Period | 25/10/2011 → 26/10/2011 |
Keywords
- Silicon solar cells
- Contact passivation
- Tunneling layer
- Aluminum oxide
- MIS contact
- PERC