Packaging of photodetector modules for 100 Gbit/s applications using electromagnetic simulations

Chenhui Jiang, Viktor Krozer, H.-G. Bach, G. G. Mekonnen, Tom Keinicke Johansen

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    Abstract

    In this paper we demonstrate ultra-broadband packaging and interconnection designs for photodetector (PD) modules for 100 Gbit/s data transmission applications. The design of packaging and interconnection structures is based on accurate and reliable 3D electromagnetic (EM) simulations. Mode conversion loss due to mode mismatch is identified as the dominant effect of limiting bandwidth of packaged modules. Finally, PD chips are successfully packaged by using wire-bonding technology and conventional coplanar waveguide (CPW) for avoiding mode mismatch. The new packaged PD module demonstrates approximately 100 GHz 3 dB bandwidth.
    Original languageEnglish
    Title of host publicationEuropean Microwave Conference, 2009. EuMC 2009.
    PublisherIEEE
    Publication date2009
    Pages1369-1372
    ISBN (Print)978-1-4244-4748-0
    DOIs
    Publication statusPublished - 2009
    Event39th European Microwave Conference - Rome, Italy
    Duration: 28 Sept 20092 Oct 2009
    Conference number: 39
    http://www.eumweek.com/2009/EuMC.asp?id=c

    Conference

    Conference39th European Microwave Conference
    Number39
    Country/TerritoryItaly
    CityRome
    Period28/09/200902/10/2009
    Internet address

    Bibliographical note

    Copyright: 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE

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