Packaging of photodetector modules for 100 Gbit/s applications using electromagnetic simulations

Chenhui Jiang, Viktor Krozer, H.-G. Bach, G. G. Mekonnen, Tom Keinicke Johansen

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearch

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Abstract

In this paper we demonstrate ultra-broadband packaging and interconnection designs for photodetector (PD) modules for 100 Gbit/s data transmission applications. The design of packaging and interconnection structures is based on accurate and reliable 3D electromagnetic (EM) simulations. Mode conversion loss due to mode mismatch is identified as the dominant effect of limiting bandwidth of packaged modules. Finally, PD chips are successfully packaged by using wire-bonding technology and conventional coplanar waveguide (CPW) for avoiding mode mismatch. The new packaged PD module demonstrates approximately 100 GHz 3 dB bandwidth.
Original languageEnglish
Title of host publicationEuropean Microwave Conference, 2009. EuMC 2009.
PublisherIEEE
Publication date2009
Pages1369-1372
ISBN (Print)978-1-4244-4748-0
DOIs
Publication statusPublished - 2009
Event39th European Microwave Conference - Rome, Italy
Duration: 28 Sep 20092 Oct 2009
Conference number: 39
http://www.eumweek.com/2009/EuMC.asp?id=c

Conference

Conference39th European Microwave Conference
Number39
CountryItaly
CityRome
Period28/09/200902/10/2009
Internet address

Bibliographical note

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