Packaging of Microsystems

Gerardo Perozziello

    Research output: Chapter in Book/Report/Conference proceedingBook chapterResearchpeer-review

    Original languageEnglish
    Title of host publicationMicrosystem Engineering of Lab-on-a-Chip Devices
    EditorsOliver Geschke, Henning Klank, Pieter Telleman
    Number of pages249
    PublisherVCH-Wiley, Weinheim
    Publication date2003
    ISBN (Print)3-527-30733-8
    Publication statusPublished - 2003

    Cite this

    Perozziello, G. (2003). Packaging of Microsystems. In O. Geschke, H. Klank, & P. Telleman (Eds.), Microsystem Engineering of Lab-on-a-Chip Devices VCH-Wiley, Weinheim.