Packaging Aspects of Photodetector Modules for 100 Gbit/s Ethernet Applications

Chenhui Jiang; G.G. Mekonnen; Viktor Krozer; Tom Keinicke Johansen; H.-G. Bach

doi:10.1109/EUMC.2008.4751771

Packaging Aspects of Photodetector Modules for 100 Gbit/s Ethernet Applications

Chenhui Jiang, G.G. Mekonnen, Viktor Krozer, Tom Keinicke Johansen, H.-G. Bach

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Abstract

Packaging is a major problem at millimetre-wave frequencies approaching 100 GHz. In this paper we present that insertion losses in a multi-chip module (MCM) can be less IL <0.6 dB at 100 GHz. The paper also analyzes in detail resonance modes in the packages. The characteristic of conductor-backed coplanar waveguides (CBCPWs) with vias is accurately analyzed using 3D electromagnetic (EM) simulation over a wide frequency range. Patch antenna mode resonances are identified as a major origin of resonances in simulated and measured transmission characteristics of the CBCPW with vias. Based on EM simulations, we propose several optimized arrangements for vias and bonding wires placement, to efficiently suppress the resonances and achieve excellent transmission performance of the PD module packaging. Based on our simulated results we postulate that it is possible to obtain resonance-free electrical transmission in the PD package with IL <0.6 dB over a frequency from DC to 110 GHz.

Original language	English
Title of host publication	38th European Microwave Conference, 2008. EuMC 2008.
Publisher	IEEE
Publication date	2008
ISBN (Print)	978-2-87487-006-4
DOIs	https://doi.org/10.1109/EUMC.2008.4751771
Publication status	Published - 2008
Event	38th European Microwave Conference - Amsterdam, Netherlands Duration: 28 Oct 2008 → 31 Oct 2008 Conference number: 38 http://www.eumweek.com/2008/EuMC.asp?id=c

Conference

Conference	38th European Microwave Conference
Number	38
Country/Territory	Netherlands
City	Amsterdam
Period	28/10/2008 → 31/10/2008
Internet address	http://www.eumweek.com/2008/EuMC.asp?id=c

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Copyright: 2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE

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title = "Packaging Aspects of Photodetector Modules for 100 Gbit/s Ethernet Applications",

abstract = "Packaging is a major problem at millimetre-wave frequencies approaching 100 GHz. In this paper we present that insertion losses in a multi-chip module (MCM) can be less IL <0.6 dB at 100 GHz. The paper also analyzes in detail resonance modes in the packages. The characteristic of conductor-backed coplanar waveguides (CBCPWs) with vias is accurately analyzed using 3D electromagnetic (EM) simulation over a wide frequency range. Patch antenna mode resonances are identified as a major origin of resonances in simulated and measured transmission characteristics of the CBCPW with vias. Based on EM simulations, we propose several optimized arrangements for vias and bonding wires placement, to efficiently suppress the resonances and achieve excellent transmission performance of the PD module packaging. Based on our simulated results we postulate that it is possible to obtain resonance-free electrical transmission in the PD package with IL <0.6 dB over a frequency from DC to 110 GHz.",

author = "Chenhui Jiang and G.G. Mekonnen and Viktor Krozer and Johansen, {Tom Keinicke} and H.-G. Bach",

note = "Copyright: 2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE; 38th European Microwave Conference, EuMC 2008 ; Conference date: 28-10-2008 Through 31-10-2008",

year = "2008",

doi = "10.1109/EUMC.2008.4751771",

language = "English",

isbn = "978-2-87487-006-4",

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T1 - Packaging Aspects of Photodetector Modules for 100 Gbit/s Ethernet Applications

AU - Jiang, Chenhui

AU - Mekonnen, G.G.

AU - Krozer, Viktor

AU - Johansen, Tom Keinicke

AU - Bach, H.-G.

N1 - Conference code: 38

PY - 2008

Y1 - 2008

N2 - Packaging is a major problem at millimetre-wave frequencies approaching 100 GHz. In this paper we present that insertion losses in a multi-chip module (MCM) can be less IL <0.6 dB at 100 GHz. The paper also analyzes in detail resonance modes in the packages. The characteristic of conductor-backed coplanar waveguides (CBCPWs) with vias is accurately analyzed using 3D electromagnetic (EM) simulation over a wide frequency range. Patch antenna mode resonances are identified as a major origin of resonances in simulated and measured transmission characteristics of the CBCPW with vias. Based on EM simulations, we propose several optimized arrangements for vias and bonding wires placement, to efficiently suppress the resonances and achieve excellent transmission performance of the PD module packaging. Based on our simulated results we postulate that it is possible to obtain resonance-free electrical transmission in the PD package with IL <0.6 dB over a frequency from DC to 110 GHz.

AB - Packaging is a major problem at millimetre-wave frequencies approaching 100 GHz. In this paper we present that insertion losses in a multi-chip module (MCM) can be less IL <0.6 dB at 100 GHz. The paper also analyzes in detail resonance modes in the packages. The characteristic of conductor-backed coplanar waveguides (CBCPWs) with vias is accurately analyzed using 3D electromagnetic (EM) simulation over a wide frequency range. Patch antenna mode resonances are identified as a major origin of resonances in simulated and measured transmission characteristics of the CBCPW with vias. Based on EM simulations, we propose several optimized arrangements for vias and bonding wires placement, to efficiently suppress the resonances and achieve excellent transmission performance of the PD module packaging. Based on our simulated results we postulate that it is possible to obtain resonance-free electrical transmission in the PD package with IL <0.6 dB over a frequency from DC to 110 GHz.

U2 - 10.1109/EUMC.2008.4751771

DO - 10.1109/EUMC.2008.4751771

M3 - Article in proceedings

SN - 978-2-87487-006-4

BT - 38th European Microwave Conference, 2008. EuMC 2008.

PB - IEEE

T2 - 38th European Microwave Conference

Y2 - 28 October 2008 through 31 October 2008

ER -

Packaging Aspects of Photodetector Modules for 100 Gbit/s Ethernet Applications

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