Packaging Aspects of Photodetector Modules for 100 Gbit/s Ethernet Applications

Chenhui Jiang, G.G. Mekonnen, Viktor Krozer, Tom Keinicke Johansen, H.-G. Bach

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearch

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Abstract

Packaging is a major problem at millimetre-wave frequencies approaching 100 GHz. In this paper we present that insertion losses in a multi-chip module (MCM) can be less IL <0.6 dB at 100 GHz. The paper also analyzes in detail resonance modes in the packages. The characteristic of conductor-backed coplanar waveguides (CBCPWs) with vias is accurately analyzed using 3D electromagnetic (EM) simulation over a wide frequency range. Patch antenna mode resonances are identified as a major origin of resonances in simulated and measured transmission characteristics of the CBCPW with vias. Based on EM simulations, we propose several optimized arrangements for vias and bonding wires placement, to efficiently suppress the resonances and achieve excellent transmission performance of the PD module packaging. Based on our simulated results we postulate that it is possible to obtain resonance-free electrical transmission in the PD package with IL <0.6 dB over a frequency from DC to 110 GHz.
Original languageEnglish
Title of host publication38th European Microwave Conference, 2008. EuMC 2008.
PublisherIEEE
Publication date2008
ISBN (Print)978-2-87487-006-4
DOIs
Publication statusPublished - 2008
Event38th European Microwave Conference - Amsterdam, Netherlands
Duration: 28 Oct 200831 Oct 2008
Conference number: 38
http://www.eumweek.com/2008/EuMC.asp?id=c

Conference

Conference38th European Microwave Conference
Number38
Country/TerritoryNetherlands
CityAmsterdam
Period28/10/200831/10/2008
Internet address

Bibliographical note

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