TY - JOUR
T1 - Oxidation and Reduction of Liquid SnPb (60/40) under Ambient and Vacuum Conditions
AU - Kuhmann, Jochen Friedrich
AU - Maly, K.
AU - Preuss, A.
AU - Adolphi, B.
AU - Wirth, T.
AU - Oesterle, W.
AU - Fanciulli, M.
AU - Weyer, G.
N1 - Copyright The Electrochemical Society, Inc. [1998]. All rights reserved. Except as provided under U.S. copyright law, this work may not be reproduced, resold, distributed, or modified without the express permission of The Electrochemical Society (ECS).
PY - 1998
Y1 - 1998
N2 - One of the most straightforward approaches to fluxless solder bonding is using vacuum conditions to prevent further oxidation and, where needed, to reduce solder oxides by the use of molecular hydrogen (H-2).(1-3) This study On oxidation and reduction of solder oxides on SnPb (60/40) is aimed to provide a better understanding for fluxless solder bonding applications under controlled atmospheric conditions; By means of scanning Auger spectroscopy it is shown, that growth of oxide films on metallic SnPb above the eutectic temperature can be significantly reduced by decreasing the O-2 partial pressure up to similar to 10(-5) Pa. The native oxide, which was left on top of one part of the samples, prevented a further scale growth even during heating at temperatures above the melting point. The native oxide consists of SnO2, which has most likely an amorphous structure, whereas the oxide, grown at 200 and 250 degrees C is crystalline SnO. For sample preparation, the reduction of the native oxide on eutectic SnPb was carried out successfully using low temperature (250 degrees C) and short heating cycles (2 min). The effectiveness of H-2 to reduce SnO2 at typical soldering parameters (240 degrees C, <2 min) was furthermore proven by in situ Auger electron spectroscopy.
AB - One of the most straightforward approaches to fluxless solder bonding is using vacuum conditions to prevent further oxidation and, where needed, to reduce solder oxides by the use of molecular hydrogen (H-2).(1-3) This study On oxidation and reduction of solder oxides on SnPb (60/40) is aimed to provide a better understanding for fluxless solder bonding applications under controlled atmospheric conditions; By means of scanning Auger spectroscopy it is shown, that growth of oxide films on metallic SnPb above the eutectic temperature can be significantly reduced by decreasing the O-2 partial pressure up to similar to 10(-5) Pa. The native oxide, which was left on top of one part of the samples, prevented a further scale growth even during heating at temperatures above the melting point. The native oxide consists of SnO2, which has most likely an amorphous structure, whereas the oxide, grown at 200 and 250 degrees C is crystalline SnO. For sample preparation, the reduction of the native oxide on eutectic SnPb was carried out successfully using low temperature (250 degrees C) and short heating cycles (2 min). The effectiveness of H-2 to reduce SnO2 at typical soldering parameters (240 degrees C, <2 min) was furthermore proven by in situ Auger electron spectroscopy.
U2 - 10.1149/1.1838608
DO - 10.1149/1.1838608
M3 - Journal article
SN - 0013-4651
VL - 145
SP - 2138
EP - 2142
JO - Journal of The Electrochemical Society
JF - Journal of The Electrochemical Society
IS - 6
ER -