O2 plasma assisted wafer bonding at room temperature

A. Egebjerg, M. Poulsen, O. Bunk, M.M. Nielsen, F. Jensen, R. Feidenhans'l

    Research output: Chapter in Book/Report/Conference proceedingBook chapterResearchpeer-review

    Original languageEnglish
    Title of host publicationHASYLAB annual report 2002. Part 1
    Place of PublicationHamburg
    PublisherHASYLAB
    Publication date2003
    Publication statusPublished - 2003

    Cite this

    Egebjerg, A., Poulsen, M., Bunk, O., Nielsen, M. M., Jensen, F., & Feidenhans'l, R. (2003). O2 plasma assisted wafer bonding at room temperature. In HASYLAB annual report 2002. Part 1 HASYLAB. http://www-hasylab.desy.de/science/annual_reports/2002_report/