Abstract
Finite element (FE) simulation of a thermoelectric (TE) module was conducted to optimize its geometrical
dimensions in terms of mechanical reliability and performance. The TE module consisted of bismuth telluride, nand
p-type legs. The geometrical dimensions of the module, i.e. leg length and leg cross-sectional area, were varied
and the corresponding maximum thermal stress, output power and efficiency of the module was obtained. The
optimal design of the module was then suggested based on minimizing the thermal stresses and maximizing the
performance, i.e. power and efficiency. The optimal dimensions at a maximum von Mises stress of 75 MPa was a
leg length of 2-2.5 mm, a leg width of 1.5-2 mm, which resulted in an efficiency of 7.2. Finally, the influence of
solders, i.e. solder material between the leg, the interconnector and the top ceramic layer, on the induced thermal
stresses and the module performance was investigated. The results revealed that transition from elastic to plastic
deformation in the solder decreases the induced thermal stresses significantly. Moreover, beyond the elastic limit the
stress magnitude is very much dependent on the magnitude and mechanism of the plastic deformation in the module.
The present study provides a basis for unique and new optimization scheme of the TE modules in terms of
endurance and performance.
Original language | English |
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Journal | Journal of Electronic Materials |
Volume | 44 |
Issue number | 11 |
Pages (from-to) | 4465-4472 |
ISSN | 0361-5235 |
DOIs | |
Publication status | Published - 2015 |
Keywords
- Thermoelectric
- Thermomechanical modeling
- Design optimization
- Efficiency
- Output power