Optimization of Packaging for PIN Photodiode Modules for 100Gbit/s Ethernet Applications

Chenhui Jiang, Tom Keinicke Johansen, Viktor Krozer, G. G. Mekonnen, H-G. Bach

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    Abstract

    In this paper the packaging of optical components is investigated employing a conductor backed coplanar waveguide (CBCPW). The study is performed using 3D electromagnetic (EM) simulations in a broadband range up to 110GHz. Higher-order resonances are observed in both measurement and simulation results. Based on the verified EM simulation setup, the origin of resonances is identified and remedies are suggested in the paper. Several optimization schemes for achieving good transmission characteristics for the planar structure as well as for the coax-CPW transition are proposed such as properly coating side metallization on the CPW, substrate spacing to the metal housing, and developing metal posts in the substrate of the CPW.
    Original languageEnglish
    Title of host publicationProceedings of 2007 Asia-Pacific Microwave Conference
    Place of PublicationBangkok Thailand
    PublisherIEEE
    Publication date2007
    Pages623-626
    ISBN (Print)1-4244-0749-4
    DOIs
    Publication statusPublished - 2007
    EventAsia Pacific Microwave Conference 2007 - Bangkok, Thailand
    Duration: 11 Dec 200714 Dec 2007

    Conference

    ConferenceAsia Pacific Microwave Conference 2007
    Country/TerritoryThailand
    CityBangkok
    Period11/12/200714/12/2007

    Bibliographical note

    Copyright: 2007 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE

    Keywords

    • Coplanar waveguides
    • higher order resonances
    • waveguide transitions
    • electromagnetic simulation

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