Optimization of Packaging for PIN Photodiode Modules for 100Gbit/s Ethernet Applications

Chenhui Jiang; Tom Keinicke Johansen; Viktor Krozer; G. G. Mekonnen; H-G. Bach

doi:10.1109/APMC.2007.4554950

Optimization of Packaging for PIN Photodiode Modules for 100Gbit/s Ethernet Applications

Chenhui Jiang, Tom Keinicke Johansen, Viktor Krozer, G. G. Mekonnen, H-G. Bach

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

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Abstract

In this paper the packaging of optical components is investigated employing a conductor backed coplanar waveguide (CBCPW). The study is performed using 3D electromagnetic (EM) simulations in a broadband range up to 110GHz. Higher-order resonances are observed in both measurement and simulation results. Based on the verified EM simulation setup, the origin of resonances is identified and remedies are suggested in the paper. Several optimization schemes for achieving good transmission characteristics for the planar structure as well as for the coax-CPW transition are proposed such as properly coating side metallization on the CPW, substrate spacing to the metal housing, and developing metal posts in the substrate of the CPW.

Original language	English
Title of host publication	Proceedings of 2007 Asia-Pacific Microwave Conference
Place of Publication	Bangkok Thailand
Publisher	IEEE
Publication date	2007
Pages	623-626
ISBN (Print)	1-4244-0749-4
DOIs	https://doi.org/10.1109/APMC.2007.4554950
Publication status	Published - 2007
Event	Asia Pacific Microwave Conference 2007 - Bangkok, Thailand Duration: 11 Dec 2007 → 14 Dec 2007

Conference

Conference	Asia Pacific Microwave Conference 2007
Country/Territory	Thailand
City	Bangkok
Period	11/12/2007 → 14/12/2007

Bibliographical note

Copyright: 2007 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE

Keywords

Coplanar waveguides
higher order resonances
waveguide transitions
electromagnetic simulation

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10.1109/APMC.2007.4554950

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title = "Optimization of Packaging for PIN Photodiode Modules for 100Gbit/s Ethernet Applications",

abstract = "In this paper the packaging of optical components is investigated employing a conductor backed coplanar waveguide (CBCPW). The study is performed using 3D electromagnetic (EM) simulations in a broadband range up to 110GHz. Higher-order resonances are observed in both measurement and simulation results. Based on the verified EM simulation setup, the origin of resonances is identified and remedies are suggested in the paper. Several optimization schemes for achieving good transmission characteristics for the planar structure as well as for the coax-CPW transition are proposed such as properly coating side metallization on the CPW, substrate spacing to the metal housing, and developing metal posts in the substrate of the CPW.",

keywords = "Coplanar waveguides, higher order resonances, waveguide transitions, electromagnetic simulation",

author = "Chenhui Jiang and Johansen, {Tom Keinicke} and Viktor Krozer and Mekonnen, {G. G.} and H-G. Bach",

note = "Copyright: 2007 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE; Asia Pacific Microwave Conference 2007, APMC'07 ; Conference date: 11-12-2007 Through 14-12-2007",

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doi = "10.1109/APMC.2007.4554950",

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AU - Johansen, Tom Keinicke

AU - Krozer, Viktor

AU - Mekonnen, G. G.

AU - Bach, H-G.

N1 - Copyright: 2007 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE

PY - 2007

Y1 - 2007

N2 - In this paper the packaging of optical components is investigated employing a conductor backed coplanar waveguide (CBCPW). The study is performed using 3D electromagnetic (EM) simulations in a broadband range up to 110GHz. Higher-order resonances are observed in both measurement and simulation results. Based on the verified EM simulation setup, the origin of resonances is identified and remedies are suggested in the paper. Several optimization schemes for achieving good transmission characteristics for the planar structure as well as for the coax-CPW transition are proposed such as properly coating side metallization on the CPW, substrate spacing to the metal housing, and developing metal posts in the substrate of the CPW.

AB - In this paper the packaging of optical components is investigated employing a conductor backed coplanar waveguide (CBCPW). The study is performed using 3D electromagnetic (EM) simulations in a broadband range up to 110GHz. Higher-order resonances are observed in both measurement and simulation results. Based on the verified EM simulation setup, the origin of resonances is identified and remedies are suggested in the paper. Several optimization schemes for achieving good transmission characteristics for the planar structure as well as for the coax-CPW transition are proposed such as properly coating side metallization on the CPW, substrate spacing to the metal housing, and developing metal posts in the substrate of the CPW.

KW - Coplanar waveguides

KW - higher order resonances

KW - waveguide transitions

KW - electromagnetic simulation

U2 - 10.1109/APMC.2007.4554950

DO - 10.1109/APMC.2007.4554950

M3 - Article in proceedings

SN - 1-4244-0749-4

SP - 623

EP - 626

BT - Proceedings of 2007 Asia-Pacific Microwave Conference

PB - IEEE

CY - Bangkok Thailand

T2 - Asia Pacific Microwave Conference 2007

Y2 - 11 December 2007 through 14 December 2007

ER -

Optimization of Packaging for PIN Photodiode Modules for 100Gbit/s Ethernet Applications

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