Optimal microstructural design for high thermal stability of pure FCC metals based on studying effect of twin boundaries character and network of grain boundaries

Hossein Alimadadi*, Alice Bastos Fanta, Ryutaro Akiyoshi, Takeshi Kasama, Anthony D. Rollett, Marcel A. J. Somers, Karen Pantleon

*Corresponding author for this work

Research output: Contribution to journalJournal articleResearchpeer-review

Abstract

Three nickel electrodeposits with comparable grain size were synthesized by tailoring the electrodeposition conditions. Thorough microstructural characterizations including electron backscatter diffraction, ion channeling contrast imaging, electron channeling contrast imaging, transmission Kikuchi diffraction, transmission electron and high annular dark-field imaging were applied. The deposits contain a high density of twin boundaries with similar microstructures in terms of grain boundary character. These materials were annealed at various temperatures to study the microstructural evolution, and hence, their thermal stability. The differences in the character of twin boundaries and morphology of the grain boundaries in as-deposited state and their influence on the microstructural evolution at elevated temperatures are analyzed. The importance of incoherent twin boundaries, and the interaction of mobile general high angle boundaries with stationary boundaries are discussed. Finally, an optimal design for high thermal stability is proposed, based on the mechanisms that were inferred from the results.
Original languageEnglish
JournalMaterials & Design
Volume151
Pages (from-to)60-73
ISSN0264-1275
DOIs
Publication statusPublished - 2018

Keywords

  • Nickel
  • Annealing
  • Electrodeposition
  • Grain boundary engineering
  • Thermal stability
  • Twin boundaries

Cite this

@article{e8bebf2d088e4598b9d48cac9f686f52,
title = "Optimal microstructural design for high thermal stability of pure FCC metals based on studying effect of twin boundaries character and network of grain boundaries",
abstract = "Three nickel electrodeposits with comparable grain size were synthesized by tailoring the electrodeposition conditions. Thorough microstructural characterizations including electron backscatter diffraction, ion channeling contrast imaging, electron channeling contrast imaging, transmission Kikuchi diffraction, transmission electron and high annular dark-field imaging were applied. The deposits contain a high density of twin boundaries with similar microstructures in terms of grain boundary character. These materials were annealed at various temperatures to study the microstructural evolution, and hence, their thermal stability. The differences in the character of twin boundaries and morphology of the grain boundaries in as-deposited state and their influence on the microstructural evolution at elevated temperatures are analyzed. The importance of incoherent twin boundaries, and the interaction of mobile general high angle boundaries with stationary boundaries are discussed. Finally, an optimal design for high thermal stability is proposed, based on the mechanisms that were inferred from the results.",
keywords = "Nickel, Annealing, Electrodeposition, Grain boundary engineering, Thermal stability, Twin boundaries",
author = "Hossein Alimadadi and Fanta, {Alice Bastos} and Ryutaro Akiyoshi and Takeshi Kasama and Rollett, {Anthony D.} and Somers, {Marcel A. J.} and Karen Pantleon",
year = "2018",
doi = "10.1016/j.matdes.2018.04.056",
language = "English",
volume = "151",
pages = "60--73",
journal = "Materials & Design",
issn = "0264-1275",
publisher = "Elsevier",

}

Optimal microstructural design for high thermal stability of pure FCC metals based on studying effect of twin boundaries character and network of grain boundaries. / Alimadadi, Hossein; Fanta, Alice Bastos; Akiyoshi, Ryutaro; Kasama, Takeshi; Rollett, Anthony D.; Somers, Marcel A. J.; Pantleon, Karen.

In: Materials & Design, Vol. 151, 2018, p. 60-73.

Research output: Contribution to journalJournal articleResearchpeer-review

TY - JOUR

T1 - Optimal microstructural design for high thermal stability of pure FCC metals based on studying effect of twin boundaries character and network of grain boundaries

AU - Alimadadi, Hossein

AU - Fanta, Alice Bastos

AU - Akiyoshi, Ryutaro

AU - Kasama, Takeshi

AU - Rollett, Anthony D.

AU - Somers, Marcel A. J.

AU - Pantleon, Karen

PY - 2018

Y1 - 2018

N2 - Three nickel electrodeposits with comparable grain size were synthesized by tailoring the electrodeposition conditions. Thorough microstructural characterizations including electron backscatter diffraction, ion channeling contrast imaging, electron channeling contrast imaging, transmission Kikuchi diffraction, transmission electron and high annular dark-field imaging were applied. The deposits contain a high density of twin boundaries with similar microstructures in terms of grain boundary character. These materials were annealed at various temperatures to study the microstructural evolution, and hence, their thermal stability. The differences in the character of twin boundaries and morphology of the grain boundaries in as-deposited state and their influence on the microstructural evolution at elevated temperatures are analyzed. The importance of incoherent twin boundaries, and the interaction of mobile general high angle boundaries with stationary boundaries are discussed. Finally, an optimal design for high thermal stability is proposed, based on the mechanisms that were inferred from the results.

AB - Three nickel electrodeposits with comparable grain size were synthesized by tailoring the electrodeposition conditions. Thorough microstructural characterizations including electron backscatter diffraction, ion channeling contrast imaging, electron channeling contrast imaging, transmission Kikuchi diffraction, transmission electron and high annular dark-field imaging were applied. The deposits contain a high density of twin boundaries with similar microstructures in terms of grain boundary character. These materials were annealed at various temperatures to study the microstructural evolution, and hence, their thermal stability. The differences in the character of twin boundaries and morphology of the grain boundaries in as-deposited state and their influence on the microstructural evolution at elevated temperatures are analyzed. The importance of incoherent twin boundaries, and the interaction of mobile general high angle boundaries with stationary boundaries are discussed. Finally, an optimal design for high thermal stability is proposed, based on the mechanisms that were inferred from the results.

KW - Nickel

KW - Annealing

KW - Electrodeposition

KW - Grain boundary engineering

KW - Thermal stability

KW - Twin boundaries

U2 - 10.1016/j.matdes.2018.04.056

DO - 10.1016/j.matdes.2018.04.056

M3 - Journal article

VL - 151

SP - 60

EP - 73

JO - Materials & Design

JF - Materials & Design

SN - 0264-1275

ER -