We here present the results of an effort to determine the influence of the parameters affecting cold-plate performance and to minimize the total thermal resistance of a CPU coldplate. An analysis based on analytical calculations and CFD simulations shows that spreading resistance is affected not only by the heat source area, cold-plate thickness and thermal conductivity of the cold-plate material, but also by the effective heat transfer coefficient of the interface between cold-plate and cooling liquid. Different options for optimizing heat transfer through the cold-plate are discussed.
|Title of host publication||Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference 2007|
|Publication status||Published - 2007|
|Event||ASME/JSME Thermal Engineering Summer Heat Transfer Conference - Vancouver, British Columbia, Canada|
Duration: 1 Jan 2007 → …
|Conference||ASME/JSME Thermal Engineering Summer Heat Transfer Conference|
|City||Vancouver, British Columbia, Canada|
|Period||01/01/2007 → …|