Abstract
We here present the results of an effort to determine the
influence of the parameters affecting cold-plate performance
and to minimize the total thermal resistance of a CPU coldplate.
An analysis based on analytical calculations and CFD
simulations shows that spreading resistance is affected not only
by the heat source area, cold-plate thickness and thermal
conductivity of the cold-plate material, but also by the effective
heat transfer coefficient of the interface between cold-plate and
cooling liquid. Different options for optimizing heat transfer
through the cold-plate are discussed.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference 2007 |
| Publication date | 2007 |
| Publication status | Published - 2007 |
| Externally published | Yes |
| Event | ASME/JSME Thermal Engineering Summer Heat Transfer Conference - Vancouver, British Columbia, Canada Duration: 1 Jan 2007 → … |
Conference
| Conference | ASME/JSME Thermal Engineering Summer Heat Transfer Conference |
|---|---|
| City | Vancouver, British Columbia, Canada |
| Period | 01/01/2007 → … |