On the electrochemical migration mechanism of tin in electronics

Daniel Minzari, Morten Stendahl Jellesen, Per Møller, Rajan Ambat

Research output: Contribution to journalJournal articleResearchpeer-review

Abstract

Electrochemical migration (ECM) of tin can result in the growth of a metal deposit with a dendritic structure from cathode to anode. In electronics, such growth can lead to short circuit of biased electrodes, potentially leading to intermittent or complete failure of an electronic device. In this paper, mechanistic aspects of ECM of tin are discussed in detail, using experimental results on ECM of tin in various environments and varying potential bias. Results on the formation of local pH changes by the electrodes and experiments observations are combined with thermodynamic stability of tin species as depicted in the Pourbaix diagram.
Original languageEnglish
JournalCorrosion Science
Volume53
Issue number10
Pages (from-to)3366-3379
ISSN0010-938X
DOIs
Publication statusPublished - 2011

Keywords

  • C. Dendrite
  • B. Potentiostatic
  • A. Tin
  • C. Electrochemical migration

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