Numerical study of the coupling layer between transducer and chip in acoustofluidic devices

William Naundrup Bodé*, Henrik Bruus

*Corresponding author for this work

Research output: Contribution to journalJournal articleResearchpeer-review

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Abstract

By numerical simulation in two and three dimensions, the coupling layer between the transducer and microfluidic chip in ultrasound acoustofluidic devices is studied. The model includes the transducer with electrodes, microfluidic chip with a liquid-filled microchannel, and coupling layer between the transducer and chip. Two commonly used coupling materials, solid epoxy glue and viscous glycerol, as well as two commonly used device types, glass capillary tubes and silicon-glass chips, are considered. It is studied how acoustic resonances in ideal devices without a coupling layer are either sustained or attenuated as a coupling layer of increasing thickness is inserted. A simple criterion based on the phase of the acoustic wave for whether a given zero-layer resonance is sustained or attenuated by the addition of a coupling layer is established. Finally, by controlling the thickness and the material, it is shown that the coupling layer can be used as a design component for optimal and robust acoustofluidic resonances.

Original languageEnglish
JournalJournal of the Acoustical Society of America
Volume149
Issue number5
Pages (from-to)3096-3105
ISSN0001-4966
DOIs
Publication statusPublished - 2021

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