Electronic systems are sometimes exposed to harsh environmental conditions of temperature and humidity. Moisturetransfer into electronic enclosures and condensation can cause several problems such as corrosion and alteration in thermalstresses. It is therefore essential to study the local climate inside the enclosures to be able to protect the electronic systems.In this work, moisture transfer into a typical electronic enclosure is numerically studied using CFD. In order to reduce theCPU-time and make a way for subsequent factorial design analysis, a simplifying modification is applied in which the real3D geometry is approximated by a 2D axial symmetry one. The results for 2D and 3D models were compared in order tocalibrate the 2D representation. Furthermore, simulation results were compared with experimental data and good agreementwas found.
|Journal||A I P Conference Proceedings Series|
|Number of pages||4|
|Publication status||Published - 2016|
|Event||13th International Conference of Numerical Analysis and Applied Mathematics 2015 (ICNAAM 2015) - Rhodes, Greece|
Duration: 22 Sep 2015 → 28 Sep 2015
|Conference||13th International Conference of Numerical Analysis and Applied Mathematics 2015 (ICNAAM 2015)|
|Period||22/09/2015 → 28/09/2015|