Novel SU-8 based vacuum wafer-level packaging for MEMS devices

Gonzalo Murillo, Zachary James Davis, Stephan Urs Keller, G. Abadal, J. Agusti, Alberto Cagliani, Nadine-Nicole Noeth, Anja Boisen, N. Barniol

    Research output: Contribution to journalJournal articleResearchpeer-review

    Abstract

    This work presents a simple and low-cost SU-8 based wafer-level vacuum packaging method which is CMOS and MEMS compatible. Different approaches have been investigated by taking advantage of the properties of SU-8, such as chemical resistance, optical transparence, mechanical reliability and versatility. A novel technique of wafer level adhesive bonding, which uses SU-8 as structural and adhesive material, has been developed and successfully demonstrated. Optical inspection and SEM images were used in order to measure the package lid bending and probe the encapsulation sealing. In addition, an indirect vacuum level measurement has been carried out by comparing the different quality factors of a test cantilever resonator when this element is packed or unpacked.
    Original languageEnglish
    JournalMicroelectronic Engineering
    Volume87
    Issue number5-8
    Pages (from-to)1173-1176
    ISSN0167-9317
    DOIs
    Publication statusPublished - 2010

    Keywords

    • Vacuum packaging
    • MEMS
    • SU-8
    • Wafer-level packaging

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