TY - JOUR
T1 - Novel SU-8 based vacuum wafer-level packaging for MEMS devices
AU - Murillo, Gonzalo
AU - Davis, Zachary James
AU - Keller, Stephan Urs
AU - Abadal, G.
AU - Agusti, J.
AU - Cagliani, Alberto
AU - Noeth, Nadine-Nicole
AU - Boisen, Anja
AU - Barniol, N.
PY - 2010
Y1 - 2010
N2 - This work presents a simple and low-cost SU-8 based wafer-level vacuum packaging method which is CMOS and MEMS compatible. Different approaches have been investigated by taking advantage of the properties of SU-8, such as chemical resistance, optical transparence, mechanical reliability and versatility. A novel technique of wafer level adhesive bonding, which uses SU-8 as structural and adhesive material, has been developed and successfully demonstrated. Optical inspection and SEM images were used in order to measure the package lid bending and probe the encapsulation sealing. In addition, an indirect vacuum level measurement has been carried out by comparing the different quality factors of a test cantilever resonator when this element is packed or unpacked.
AB - This work presents a simple and low-cost SU-8 based wafer-level vacuum packaging method which is CMOS and MEMS compatible. Different approaches have been investigated by taking advantage of the properties of SU-8, such as chemical resistance, optical transparence, mechanical reliability and versatility. A novel technique of wafer level adhesive bonding, which uses SU-8 as structural and adhesive material, has been developed and successfully demonstrated. Optical inspection and SEM images were used in order to measure the package lid bending and probe the encapsulation sealing. In addition, an indirect vacuum level measurement has been carried out by comparing the different quality factors of a test cantilever resonator when this element is packed or unpacked.
KW - Vacuum packaging
KW - MEMS
KW - SU-8
KW - Wafer-level packaging
U2 - 10.1016/j.mee.2009.12.048
DO - 10.1016/j.mee.2009.12.048
M3 - Journal article
SN - 0167-9317
VL - 87
SP - 1173
EP - 1176
JO - Microelectronic Engineering
JF - Microelectronic Engineering
IS - 5-8
ER -