Nanoscale Soldering of Positioned Carbon Nanotubes using Highly Conductive Electron Beam Induced Gold Deposition

Dorte Nørgaard Madsen, Kristian Mølhave, Ramona Valentina Mateiu, Peter Bøggild, A.M. Rasmussen, C.C. Appel, M Brorson, C.J.H. Jacobsen

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    Abstract

    We have developed an in-situ method for controlled positioning of carbon nanotubes followed by highly conductive contacting of the nanotubes, using electron beam assisted deposition of gold. The positioning and soldering process takes place inside an Environmental Scanning Electron Microscope (E-SEM) in the presence of a source of gold-organic precursor gas. Bridges deposited between suspended microelectrodes show resistivities down to 10-4 Ωcm and Transmission Electron Microscopy (TEM) of the deposits reveals a dense core of gold particles surrounded by a crust of small gold nanoparticles embedded in a carbon matrix. Nanoscale soldering of multi-walled carbon nanotubes (MWNT) onto microelectrodes was achieved by deposition of a conducting gold line across a contact point between nanotube and electrode. The solderings were found to be mechanically stronger than the carbon nanotubes. We have positioned MWNTs to bridge the gap between two electrodes, and formed soldering bonds between the tube and each of the electrodes. All nanotube bridges showed ohmic resistances in the range 10-30 kΩ. We observed no increase in resistance after exposing the MWNT bridge to air for days.
    Original languageEnglish
    Title of host publicationProceedings of the Third Conference on Nanotechnology
    Volume2
    PublisherIEEE
    Publication date2003
    ISBN (Print)0-7803-7976-4
    DOIs
    Publication statusPublished - 2003
    Event3rd IEEE Conference on Nanotechnology - San Francisco, CA, United States
    Duration: 12 Aug 200314 Aug 2003
    Conference number: 3

    Conference

    Conference3rd IEEE Conference on Nanotechnology
    Number3
    CountryUnited States
    CitySan Francisco, CA
    Period12/08/200314/08/2003

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