Multiple through-wafer interconnects with advanced
                metallization system for solder bonding.

Matthias Heschel; Kjeld Rasmussen; Peter Torben Tang; Jochen Friedrich Kuhmann; Siebe Bouwstra

Multiple through-wafer interconnects with advanced metallization system for solder bonding.

Matthias Heschel
, Kjeld Rasmussen
, Peter Torben Tang
, Jochen Friedrich Kuhmann
, Siebe Bouwstra

Department of Chemistry

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

Original language	English
Title of host publication	Multiple through-wafer interconnects with advanced metallization system for solder bonding.
Publication date	1999
Pages	1228-31
Publication status	Published - 1999
Event	10th International Conference on Solid-State Sensors and Actuators (Transducers ’99) - Sendai, Japan Duration: 1 Jan 1999 → … Conference number: 10

Conference

Conference	10th International Conference on Solid-State Sensors and Actuators (Transducers ’99)
Number	10
Country/Territory	Japan
City	Sendai
Period	01/01/1999 → …

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Cite this

@inproceedings{a61d04a6981646639e6dd921cd6fd66f,

title = "Multiple through-wafer interconnects with advanced metallization system for solder bonding.",

author = "Matthias Heschel and Kjeld Rasmussen and Tang, \{Peter Torben\} and Kuhmann, \{Jochen Friedrich\} and Siebe Bouwstra",

year = "1999",

language = "English",

pages = "1228--31",

booktitle = "Multiple through-wafer interconnects with advanced metallization system for solder bonding.",

note = "10th International Conference on Solid-State Sensors and Actuators (Transducers {\textquoteright}99), Transducers {\textquoteright}99 ; Conference date: 01-01-1999",

}

Heschel, M, Rasmussen, K, Tang, PT, Kuhmann, JF & Bouwstra, S 1999, Multiple through-wafer interconnects with advanced metallization system for solder bonding. in Multiple through-wafer interconnects with advanced metallization system for solder bonding.. pp. 1228-31, 10th International Conference on Solid-State Sensors and Actuators (Transducers ’99), Sendai, Japan, 01/01/1999.

Multiple through-wafer interconnects with advanced metallization system for solder bonding. / Heschel, Matthias; Rasmussen, Kjeld; Tang, Peter Torben et al.
Multiple through-wafer interconnects with advanced metallization system for solder bonding.. 1999. p. 1228-31.

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

TY - GEN

T1 - Multiple through-wafer interconnects with advanced metallization system for solder bonding.

AU - Heschel, Matthias

AU - Rasmussen, Kjeld

AU - Tang, Peter Torben

AU - Kuhmann, Jochen Friedrich

AU - Bouwstra, Siebe

N1 - Conference code: 10

PY - 1999

Y1 - 1999

M3 - Article in proceedings

SP - 1228

EP - 1231

BT - Multiple through-wafer interconnects with advanced metallization system for solder bonding.

T2 - 10th International Conference on Solid-State Sensors and Actuators (Transducers ’99)

Y2 - 1 January 1999

ER -