@inproceedings{e5cd1baa70054a2e91cd6d13ef39ba4c,
title = "Multiple through-wafer interconnects with advanced metallization system for solder bonding.",
author = "Matthias Heschel and Kjeld Rasmussen and Kuhmann, \{Jochen Friedrich\} and Siebe Bouwstra",
year = "1999",
language = "English",
pages = "121--24",
booktitle = "Multiple through-wafer interconnects with advanced metallization system for solder bonding.",
note = "The IMAPS Nordic 36th Annual Conference ; Conference date: 19-09-1999 Through 22-09-1999",
}