Multiple through-wafer interconnects with advanced metallization system for solder bonding.

Matthias Heschel, Kjeld Rasmussen, Jochen Friedrich Kuhmann, Siebe Bouwstra

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Original languageEnglish
Title of host publicationMultiple through-wafer interconnects with advanced metallization system for solder bonding.
Publication date1999
Pages121-24
Publication statusPublished - 1999
EventThe 36th IMAPS Nordic annual conference - Helsinki
Duration: 1 Jan 1999 → …

Conference

ConferenceThe 36th IMAPS Nordic annual conference
CityHelsinki
Period01/01/1999 → …

Cite this

Heschel, M., Rasmussen, K., Kuhmann, J. F., & Bouwstra, S. (1999). Multiple through-wafer interconnects with advanced metallization system for solder bonding. In Multiple through-wafer interconnects with advanced metallization system for solder bonding. (pp. 121-24)