Multiple through-wafer interconnects with advanced metallization system for solder bonding.

Matthias Heschel, Kjeld Rasmussen, Peter Torben Tang, Jochen Friedrich Kuhmann, Siebe Bouwstra

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Original languageEnglish
Title of host publicationMultiple through-wafer interconnects with advanced metallization system for solder bonding.
Publication date1999
Pages1228-31
Publication statusPublished - 1999
Event10th International Conference on Solid-State Sensors and Actuators (Transducers ’99) - Sendai, Japan
Duration: 1 Jan 1999 → …
Conference number: 10

Conference

Conference10th International Conference on Solid-State Sensors and Actuators (Transducers ’99)
Number10
Country/TerritoryJapan
CitySendai
Period01/01/1999 → …

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