Original language | English |
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Title of host publication | Multiple through-wafer interconnects with advanced metallization system for solder bonding. |
Publication date | 1999 |
Pages | 1228-31 |
Publication status | Published - 1999 |
Event | 10th International Conference on Solid-State Sensors and Actuators (Transducers ’99) - Sendai, Japan Duration: 1 Jan 1999 → … Conference number: 10 |
Conference
Conference | 10th International Conference on Solid-State Sensors and Actuators (Transducers ’99) |
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Number | 10 |
Country/Territory | Japan |
City | Sendai |
Period | 01/01/1999 → … |