Multiple through-wafer interconnects for stacking of
                microsystems.

Matthias Heschel, Kjeld Rasmussen, Jochen Friedrich Kuhmann, Siebe Bouwstra

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

Original language	English
Title of host publication	Multiple through-wafer interconnects for stacking of microsystems.
Publication date	1999
Pages	537-40
Publication status	Published - 1999
Event	IMECE'99 - Nashville, Texas Duration: 1 Jan 1999 → …

OpenUrl availability

@inproceedings{187411791f7743fd977b32f9eac8d1fd,

title = "Multiple through-wafer interconnects for stacking of microsystems.",

author = "Matthias Heschel and Kjeld Rasmussen and Kuhmann, {Jochen Friedrich} and Siebe Bouwstra",

year = "1999",

language = "English",

pages = "537--40",

booktitle = "Multiple through-wafer interconnects for stacking of microsystems.",

note = "IMECE'99 ; Conference date: 01-01-1999",

}

Multiple through-wafer interconnects for stacking of microsystems. / Heschel, Matthias; Rasmussen, Kjeld; Kuhmann, Jochen Friedrich et al.
Multiple through-wafer interconnects for stacking of microsystems.. 1999. p. 537-40.

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

TY - GEN

T1 - Multiple through-wafer interconnects for stacking of microsystems.

AU - Heschel, Matthias

AU - Rasmussen, Kjeld

AU - Kuhmann, Jochen Friedrich

AU - Bouwstra, Siebe

PY - 1999

Y1 - 1999

M3 - Article in proceedings

SP - 537

EP - 540

BT - Multiple through-wafer interconnects for stacking of microsystems.

T2 - IMECE'99

Y2 - 1 January 1999

ER -