Molecular dynamics simulation of the thermal transport on holey copper substrates

Wenfu Situ*, Harvey A. Zambrano, Jens Honore Walther

*Corresponding author for this work

Research output: Contribution to conferencePosterResearchpeer-review

30 Downloads (Pure)

Abstract

The mechanism behind heat transfer at the nanoscale is different from that at macroscale as the size of the surface structure reaches the phonon mean free path. In this work, we investigate the effect of the presence of a nano hole on the solidliquid heat transfer. To this end, we perform molecular dynamics simulations of a water film in contact with a copper substrate with nanoscale surface structures–here represented by nanoholes. Our results indicate that the presence of a nanohole with diameter of 20 Å increases significantly the transfer of thermal energy from the copper substrate to the water film.
Original languageEnglish
Publication date2019
Number of pages1
Publication statusPublished - 2019
Event14th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics (HEFAT 2019) - Wicklow, Ireland
Duration: 22 Jul 201924 Jul 2019

Conference

Conference14th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics (HEFAT 2019)
CountryIreland
CityWicklow
Period22/07/201924/07/2019

Fingerprint Dive into the research topics of 'Molecular dynamics simulation of the thermal transport on holey copper substrates'. Together they form a unique fingerprint.

Cite this